Datasheet > B58601E3265B675

B58601E3265B675

更新时间： 2024-03-03 10:07:36

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
10页	448K
描述
Pressure sensor die

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中文翻译

获取价格

数据手册

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B58601E3265B675 数据手册

Pressure sensors

C32 series

B58601E32**B497

Gauge pressure sensor die C32/2

Applications

 Medical devices

 Automotive

 Medical

Features

 Piezoresistive MEMS technology

 Small dimensions: 1.65 × 1.65 mm

 Square diaphragm

 Measured media (back side):

Non-aggressive gases and fluids.

Unsuitable for substances, which react with glass or silicon.

 Wheatstone bridge with mV output,

ratiometric to supply voltage

 Rated pressure range: 1.6 up to 40 bar

 Outstanding long-term stability

Delivery mode

 Tape, Tray

Dimensional drawings

150

A B

1650±100

300±5

800±20

713

Note1

125

X10

allowable edge disruptions

80 µm max.

allowable edge disruptions

50 µm max.

X10

electrical diagram:

760

260

1425

Si 100

glass

BOROFLOATTM

X10

Wire bond pad area

Bond wires should not touch die surface

outside specified area

Note1: geometry of diaphragm depends on

specification

X1 : Vout+

X2 : VDD–

X4 : Vout–

X5 : VDD+

all dimensions in µm

X10 : Substrate

TPS PRS SD PD

2021-03-08

Please read Cautions and warnings and

Page 2 of 10

Important notes at the end of this document.

123 4 5 6 7...10

中文翻译

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