Pressure sensors
B58601E32xxB709/711
AER xx.xx C32/4 F00 G08 N
Gauge pressure sensor die (open bridge, High TCR)
Applications
Medical devices
Automotive
Medical
Features
Piezoresistive MEMS technology
Small dimensions: 1.65 × 1.65 mm
Square diaphragm
Measured media (back side):
Non-aggressive gases and fluids.
Unsuitable for substances which react with glass or silicon.
Wheatstone bridge with mV output,
ratiometric to supply voltage
Rated pressure range: 1.6 up to 40 bar
Outstanding long-term stability
Delivery mode
Tape, Tray
Dimensional drawings
150
A B
1650±100
300±5
800±20
700
700
Note1
100
B
X10
X5
X1
X10
A
allowable edge disruptions
80 µm max.
allowable edge disruptions
50 µm max.
X10
X4
X2
X10
60
X3
electrical diagram:
495
700
X5
700
Si 100
glass
p
BOROFLOATTM
X10
X4
Wire bond pad area
Bond wires should not touch die surface
outside specified area
R2
R4
R1
R3
Note1: geometry of diaphragm depends on
specification
X1 : Vout+
X2 : VDD–
X3 : VDD–
X4 : Vout–
X5 : VDD+
X1
X2 X3
all dimensions in µm
X10 : Substrate
All technical data are defined for pressure application from passive side. Sign of output voltage will change by pressure
application from active side.
TPS PRS SD PD
2021-03-08
Please read Cautions and warnings and
Page 2 of 10
Important notes at the end of this document.