Datasheet > B57864S0502H040

B57864S0502H040

更新时间： 2024-03-03 10:09:51

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B57864S0502H040 数据手册

Temperature measurement

B57864S

S864

Miniature sensors with bendable wires

Mounting instructions

Soldering

1.1

Leaded NTC thermistors

Leaded thermistors comply with the solderability requirements specified by CECC.

When soldering, care must be taken that the NTC thermistors are not damaged by excessive

heat. The following maximum temperatures, maximum time spans and minimum distances have

to be observed:

Dip soldering

max. 260 °C

max. 4 s

Iron soldering

max. 360 °C

max. 2 s

Bath temperature

Soldering time

Distance from thermistor

min. 6 mm

Under more severe soldering conditions the resistance may change.

1.1.1 Wave soldering

Temperature characteristic at component terminal with dual wave soldering

1.2

Leadless NTC thermistors

In case of NTC thermistors without leads, soldering is restricted to devices which are provided

with a solderable metallization. The temperature shock caused by the application of hot solder

may produce fine cracks in the ceramic, resulting in changes in resistance.

To prevent leaching of the metallization, solder with silver additives or with a low tin content

Please read Cautions and warnings and

Important notes at the end of this document.

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