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B57820M0841A004 PDF预览

B57820M0841A004

更新时间: 2024-03-03 10:10:48
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
20页 446K
描述
Nominal Resistance=0.8432kΩ

B57820M0841A004 数据手册

 浏览型号B57820M0841A004的Datasheet PDF文件第4页浏览型号B57820M0841A004的Datasheet PDF文件第5页浏览型号B57820M0841A004的Datasheet PDF文件第6页浏览型号B57820M0841A004的Datasheet PDF文件第8页浏览型号B57820M0841A004的Datasheet PDF文件第9页浏览型号B57820M0841A004的Datasheet PDF文件第10页 
Temperature measurement and compensation  
Leadless NTCs  
B57820M  
M820  
should be used. In addition, soldering methods should be employed which permit short soldering  
times.  
1.3  
SMD NTC thermistors  
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with  
silver-palladium termination. The use of no-clean solder products is recommended. In any case  
mild, non-activated fluxes should be used. Flux residues after soldering should be minimized.  
SMD NTCs with AgPd termination are not approved for lead-free soldering.  
Nickel barrier termination  
Figure 1  
SMD NTC thermistors, structure of nickel  
barrier termination  
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the  
silver base metallization layer. This allows great flexibility in the selection of soldering parameters.  
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The  
nickel barrier termination is tested for all commonly-used soldering methods according to IEC  
60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in sol-  
vent is not recommended.  
The following test and process conditions apply for nickel barrier termination.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 7 of 20  

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