Datasheet > B57227K0333A001

B57227K0333A001

更新时间： 2024-03-03 10:11:15

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
11页	301K
描述
Nominal Resistance=32.762kΩ

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B57227K0333A001 数据手册

Temperature measurement

Probe assemblies

B57227K

K227

Cautions and warnings

General

See "Important notes" on page 2.

Storage

Store thermistors only in original packaging. Do not open the package prior to processing.

Storage conditions in original packaging: storage temperature ꢀ25 °C ... +45 °C, relative

humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is

inadmissible.

Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the

packing material may be deformed or components may stick together, causing problems during

mounting.

Avoid contamination of thermistor surface during storage, handling and processing.

Avoid storage of thermistors in harmful environments like corrosive gases (SO_x, Cl etc).

Use the components as soon as possible after opening the original packaging.

Solder thermistors within the time specified after shipment from EPCOS.

For leaded components this is 24 months, for SMD components with nickel barrier termination

12 months, for leadless components this is 12 months, for SMD components with AgPd

termination 6 months.

Handling

NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused

during handling of NTCs.

Do not touch components with bare hands. Gloves are recommended.

Avoid contamination of thermistor surface during handling.

Washing processes may damage the product due to the possible static or cyclic mechanical

loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,

which might lead to reduced reliability or lifetime.

Bending / twisting leads

A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from

the component head or housing. When bending ensure the wire is mechanically relieved at the

component head or housing. The bending radius should be at least 0.75 mm.

Soldering

Use resin-type flux or non-activated flux.

Insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended.

Complete removal of flux is recommended.

Please read Cautions and warnings and

Important notes at the end of this document.

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