Datasheet > B32-200-LF

B32-200-LF

更新时间： 2024-03-03 10:09:30

品牌	Logo	应用领域
国巨 - YAGEO		/
页数	文件大小	规格书
6页	414K
描述
陶瓷气体放电管

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B32-200-LF 数据手册

Product Specification

Circuit Protection

B32-H2.5

series

GAS DISCHARGE TUBS

10 times repetition of cycle -40℃/30min

→normal, temp/2 min →125℃/30min, measurement after

normal temp/2 HRS.

Temperature

Cycle

Check for solder adhesion after 260±5℃ for 3sec , The

body immersion depth 1.5mm in molten solder

Solder Ability

Solder Heat

Evenly covered by solder.

Conformed to rated spec.

Measurement after 260±5℃ solder for 10sec, The body

immersion depth 1.5mm in molten solder

Recommended Soldering Conditions

Reflow Soldering

Recommended Conditions

Profile Feature

Pb-Free Assembly

Average ramp-up rate (T_Lto T_P)

Preheat

3℃/second max.

-Temperature Min (T_{S min}

-Temperature Max (T_{S max}

)

150℃

200℃

)

-Time (min to max) (ts)

60-180 seconds

T_{S max}to T_L

-Ramp-up Rate

3℃/second max.

Time maintained above:

-Temperature (T_L)

-Time (t_L)

217℃

60-150 seconds

Peak Temperature (T_P)

260℃

Time within 5℃ of actual Peak Temperature (t_P)

Ramp-down Rate

20-40 seconds

6℃/second max.

8 minutes max.

Time 25℃ to Peak Temperature

1 2 345 6

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