Datasheet > B048F160T24-EB

B048F160T24-EB

更新时间： 2022-09-29 11:47:54

品牌	Logo	应用领域
VICOR		/
页数	文件大小	规格书
12页	833K
描述
EVAL BOARD 16V OUT 240W SMD

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数据手册

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B048F160T24-EB 数据手册

End of Life - Replaced by BCM48Bx160y240A00

B048F160T24

Configuration Options

RECOMMENDED LAND PATTERN

(NO GROUNDING CLIPS)

TOP SIDE SHOWN

NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE

FREE OF COPPER, ALL PCB LAYERS.

2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],

THIS PROVIDES 7.00 [0.275] COMPONENT

EDGE-TO-EDGE SPACING, AND 0.50 [0.020]

CLEARANCE BETWEEN VICOR HEAT SINKS.

(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],

THIS PROVIDES 8.50 [0.334] COMPONENT

EDGE-TO-EDGE SPACING, AND 2.00 [0.079]

CLEARANCE BETWEEN VICOR HEAT SINKS.

3. VI CHIP^®MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY;

ACTUAL LAND PATTERN MAY DIFFER.

DIMENSIONS FROM EDGES OF LAND PATTERN

TO PUSH-PIN HOLES WILL BE THE SAME FOR

ALL FULL SIZE VI CHIP PRODUCTS.

RECOMMENDED LAND PATTERN

(With GROUNDING CLIPS)

TOP SIDE SHOWN

4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.

5. UNLESS OTHERWISE SPECIFIED:

DIMENSIONS ARE MM [INCH].

TOLERANCES ARE:

X.X [X.XX] = 0.3 [0.01]

X.XX [X.XXX] = 0.13 [0.005]

6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)

SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND

DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.

Figure 19 — Hole location for push pin heat sink relative to VI Chip^®module

BCM^®Bus Converter

Page 9 of 12

Rev 3.0

vicorpower.com

800 927.9474

01/2014

1...6 7 8910 11 12

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