Datasheet > AU5790D8-T

AU5790D8-T

更新时间： 2024-01-28 17:59:49

品牌	Logo	应用领域
恩智浦 - NXP		光电二极管
页数	文件大小	规格书
19页	104K
描述
IC DATACOM, INTERFACE CIRCUIT, PDSO8, PLASTIC, SOT-96, SO-8, Network Interface

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技术参数
数据手册

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AU5790D8-T 技术参数

生命周期：	Obsolete	零件包装代码：	SOIC
包装说明：	SOP,	针数：	8
Reach Compliance Code：	unknown	HTS代码：	8542.39.00.01
风险等级：	5.84	JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e4	长度：	4.9 mm
功能数量：	1	端子数量：	8
最高工作温度：	125 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	SOP
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
认证状态：	Not Qualified	座面最大高度：	1.75 mm
标称供电电压：	12 V	表面贴装：	YES
电信集成电路类型：	INTERFACE CIRCUIT	温度等级：	AUTOMOTIVE
端子面层：	NICKEL PALLADIUM GOLD	端子形式：	GULL WING
端子节距：	1.27 mm	端子位置：	DUAL
宽度：	3.9 mm	Base Number Matches：	1

AU5790D8-T 数据手册

Philips Semiconductors

Preliminary specification

Single wire CAN transceiver

AU5790

T =T + P * θ

THERMAL CHARACTERISTICS

The AU5790 provides protection from thermal overload. When the

IC junction temperature reaches the threshold (≈155°C), the

AU5790 will disable the transmitter drivers, reducing power

dissipation to protect the device. The transmit function will become

available again after the junction temperature drops. The thermal

shutdown hysteresis is about 5°C.

where: T is junction temperature (°C);

T is ambient temperature (°C);

P is dissipated power (W);

is thermal resistance (°C/W).

Thermal Resistance

Thermal resistance is the ability of a packaged IC to dissipate heat

to its environment. In semiconductor applications, it is highly

dependant on the IC package, PCBs, and airflow. Thermal

resistance also varies slightly with input power, the difference

between ambient and junction temperatures, and soldering material.

In order to avoid this transmit function shutdown, care must be taken

to not overheat the IC during application. The relationships between

junction temperature, ambient temperature, dissipated power, and

thermal resistance can be expressed as:

Figures 4 and 5 show the thermal resistance as the function of the

IC package and the PCB configuration, assuming no airflow.

200

150

100

very low

conductance

board

low

conductance

board

high

conductance

board

100

150

200

250

SL01249

Cu area on fused pins (mm2)

Figure 4.

SO-8 Thermal Resistance vs. PCB Configuration

150

100

very low

conductance

board

low

conductance

board

high

conductance

board

100

200

300

400

500

SL01250

Cu area on fused pins (mm2)

Figure 5.

SO-14 Thermal Resistance vs. PCB Configuration

2000 Jun 09

1...10 11 121314 15 16...19

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