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AU5790D14/N,118 PDF预览

AU5790D14/N,118

更新时间: 2024-02-13 02:32:58
品牌 Logo 应用领域
恩智浦 - NXP 光电二极管
页数 文件大小 规格书
20页 120K
描述
IC DATACOM, INTERFACE CIRCUIT, PDSO14, PLASTIC, SO-14, Network Interface

AU5790D14/N,118 数据手册

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Philips Semiconductors  
Product data  
Single wire CAN transceiver  
AU5790  
Table 3 shows the maximum power dissipation of an AU5790 without tripping the thermal overload protection, for specified combinations of  
package, board configuration, and ambient temperature.  
Table 3. Maximum power dissipation  
Θ
P
tot  
JA  
Power Dissipation Max.  
T = 85 °C T = 125 °C  
Thermal Resistance  
a
a
Additional Foil Area for  
Heat Dissipation  
Board Type  
SO-8 on High  
K/W  
103  
82  
mW  
631  
793  
mW  
243  
305  
Normal traces  
Conductance Board  
225 Sq. mm of copper  
foil attached to pin 8.  
SO-8 on Low  
Conductance Board  
Normal traces  
163  
119  
399  
546  
153  
210  
225 Sq. mm of copper  
attached to pin 8.  
SO-8 on Very Low  
Conductance Board  
Normal traces  
194  
135  
335  
481  
129  
185  
225 Sq. mm of copper  
attached to pin 8.  
SO-14 on High  
Conductance Board  
Normal traces  
63  
50  
1032  
1300  
397  
500  
105 Sq. mm of copper  
attached to each of pins  
1, 7, 8, & 14.  
SO-14 on Low  
Conductance Board  
Normal traces  
103  
70  
631  
929  
243  
357  
105 Sq. mm of copper  
attached to each of pins  
1, 7, 8, & 14.  
SO-14 on Very Low  
Conductance Board  
Normal traces  
126  
82  
516  
793  
198  
305  
105 Sq. mm of copper  
attached to each of pins  
1, 7, 8, & 14.  
NOTES:  
1. The High Conductance board is based on modeling done to EIA/JEDEC Standard JESD51-7. The board emulated contains two one ounce  
thick copper ground planes, and top surface copper conductor traces of two ounce (0.071 mm thickness of copper).  
2. The Low Conductance board is based on modeling done to EIA/JEDEC Standard EIA/JESD51-3. The board does not contain any ground  
planes, and the top surface copper conductor traces of two ounce (0.071 mm thickness of copper).  
3. The Very Low Conductance board is based on the EIA/JESD51-3, however the thickness of the surface conductors has been reduced to  
0.035 mm (also referred to as 1.0 Ounce copper).  
4. The above mentioned JEDEC specifications are available from: http://www.jedec.org/  
15  
2001 May 18  

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