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ATF22V10B-25GI PDF预览

ATF22V10B-25GI

更新时间: 2024-01-26 18:52:21
品牌 Logo 应用领域
爱特美尔 - ATMEL /
页数 文件大小 规格书
14页 886K
描述
Flash PLD, 25ns, PAL-Type, CMOS, CDIP24, 0.300 INCH, CERDIP-24

ATF22V10B-25GI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSSOP包装说明:TSSOP, TSSOP24,.25
针数:24Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.88
架构:PAL-TYPE最大时钟频率:33.3 MHz
JESD-30 代码:R-PDSO-G24JESD-609代码:e0
长度:7.8 mm湿度敏感等级:2
专用输入次数:11I/O 线路数量:10
输入次数:22输出次数:10
产品条款数:132端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
组织:11 DEDICATED INPUTS, 10 I/O输出函数:MACROCELL
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP24,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):240
电源:5 V可编程逻辑类型:FLASH PLD
传播延迟:25 ns认证状态:Not Qualified
座面最大高度:1.2 mm子类别:Programmable Logic Devices
最大供电电压:5.5 V最小供电电压:4.5 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:4.4 mm

ATF22V10B-25GI 数据手册

 浏览型号ATF22V10B-25GI的Datasheet PDF文件第8页浏览型号ATF22V10B-25GI的Datasheet PDF文件第9页浏览型号ATF22V10B-25GI的Datasheet PDF文件第10页浏览型号ATF22V10B-25GI的Datasheet PDF文件第11页浏览型号ATF22V10B-25GI的Datasheet PDF文件第12页浏览型号ATF22V10B-25GI的Datasheet PDF文件第14页 
ATF22V10B  
Packaging Information  
24D3, 24-Lead, 0.300" Wide, Non-Windowed,  
28J, 28-Lead, Plastic J-Leaded Chip Carrier (PLCC)  
Ceramic Dual Inline Package (Cerdip)  
Dimensions in Inches and (Millimeters)  
MIL-STD-1835 D-9 CONFIG A  
Dimensions in Inches and (Millimeters)  
JEDEC STANDARD MS-018 AB  
.045(1.14) X 30° - 45°  
.045(1.14) X 45° PIN NO. 1  
IDENTIFY  
.012(.305)  
.008(.203)  
1.28(32.5)  
1.24(31.5)  
PIN  
1
.430(10.9)  
.390(9.91)  
.021(.533)  
.013(.330)  
SQ  
.456(11.6)  
.450(11.4)  
.310(7.87)  
.285(7.24)  
SQ  
.032(.813)  
.026(.660)  
.495(12.6)  
.485(12.3)  
SQ  
.098(2.49)  
MAX  
1.100(27.94) REF  
.050(1.27) TYP  
.043(1.09)  
.005(.127)  
MIN  
.200(5.08)  
MAX  
.300(7.62) REF SQ  
.020(.508)  
.120(3.05)  
.090(2.29)  
SEATING  
PLANE  
.180(4.57)  
.165(4.19)  
.060(1.52)  
.015(.381)  
.023(.584)  
.200(5.08)  
.125(3.18)  
.065(1.65)  
.045(1.14)  
.014(.356)  
.022(.559) X 45° MAX (3X)  
.110(2.79)  
.090(2.29)  
.325(8.25)  
.300(7.62)  
0
15  
REF  
.015(.381)  
.008(.203)  
.400(10.2) MAX  
28L, 28-Pad, Non-Windowed, Ceramic Leadless  
24P3, 24-Lead, 0.300" Wide, Plastic Dual Inline  
Chip Carrier (LCC)  
Package (PDIP)  
Dimensions in Inches and (Millimeters)  
MIL-STD-1835 C-4  
Dimensions in Inches and (Millimeters)  
JEDEC STANDARD MS-001 AF  
1.27(32.3)  
1.25(31.7)  
PIN  
1
.266(6.76)  
.250(6.35)  
.090(2.29)  
MAX  
1.100(27.94) REF  
.200(5.06)  
MAX  
.005(.127)  
MIN  
SEATING  
PLANE  
.070(1.78)  
.020(.508)  
.023(.584)  
.014(.356)  
.151(3.84)  
.125(3.18)  
.065(1.65)  
.040(1.02)  
.110(2.79)  
.090(2.29)  
.325(8.26)  
.300(7.62)  
0
15  
REF  
.012(.305)  
.008(.203)  
.400(10.2) MAX  
13  

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