Datasheet > AT88SA10HS_11

AT88SA10HS_11

更新时间： 2022-10-12 00:42:51

品牌	Logo	应用领域
爱特美尔 - ATMEL		/
页数	文件大小	规格书
25页	236K
描述
Atmel CryptoAuthentication Host Security Chip

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中文翻译

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数据手册

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AT88SA10HS_11 数据手册

8X –TSSOP

Pin 1 indicatorꢀ

this corner

Top View

End View

COMMON DIMENSIONS

(Unit of Measure = mm)

MIN

MAX

1.20

NOM

NOTE

2, 5

SYMBOL

Side View

0.05

0.80

2.90

0.15

Notes: 1. This drawing is for general information oy.nl Refer to

JEDEC Drawing MO-153, VariationAA, for proper

dimensions, tolerances, datums, etc.

1.00

3.00

1.05

3.10

2. Dimension D does not include mold Flash, protrusions or

gate burrs. Mold Flash, protrusions and gate burrs shall not

exceed 0.15mm (0.006in) per side.

3. Dimension E1 does not include inter-lead Flash or

protrusions. Inter-lead Flash and protrusions shall not exceed

0.25mm (0.010in) per side.

4. Dimension b does not include Dambar protrusion.

Allowable Dambar protrusion shall be 0.08 mm total in excess

of the b dimension at maximum material condition. Dambar

cannot be located on the lower radius of the foot. Minimum

space between protrusion and adjacent lead is 0.07mm.

5. Dimension D and E1 to be determined at Datum Plane H.

6.40 BSC

4.50

4.30

0.19

4.40

–

3, 5

0.30

0.65 BSC

0.60

0.45

0.75

1.00 REF

0.09

0.20

6/22/11

REV.

TITLE

GPC

TNR

DRAWING NO.

Package Drawing Contact:

packagedrawings@atmel.com

8X, 8-lead 4.4mm Body, Plastic Thin

Shrink Small Outline Package (TSSOP)

Atmel AT88SA10HS [DATASHEET]

8595G−CRYPTO−9/11

1...19 20 212223 24 25

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