Datasheet > AT88SA10HS_10

AT88SA10HS_10

更新时间： 2022-03-03 23:03:53

品牌	Logo	应用领域
爱特美尔 - ATMEL		/
页数	文件大小	规格书
23页	276K
描述
Atmel CryptoAuthentication Host Security Chip

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AT88SA10HS_10 数据手册

Atmel AT88SA10HS Host Authentication Chip

Package Drawing

3TS1 – Shrink SOT

GND

SDA

V_CC

End View

Top View

SEATING

PLANE

Side View

COMMON DIMENSIONS

(Unit of Measure = mm)

Notes:

1. Dimension D does not include mold flash, protrusions or gate burrs.

Mold flash, protrusions or gate burrs shall not exceed 0.25mm per

end. Dimension E1 does not include interlead flash or protrusion.

Interlead flash or protrusion shall not exceed 0.25mm per side.

2. The package top may be smaller than the package bottom.

Dimensions D and E1 are determined at the outermost extremes of

the plastic body exclusive of mold flash, tie bar burrs, gate burrs and

interlead flash, but including any mismatch between the top and

bottom of the plastic body.

MIN

0.89

0.01

0.88

2.80

2.10

1.20

MAX

1.12

0.10

1.02

3.04

2.64

1.40

NOM

NOTE

SYMBOL

1,2

2.90

3. These dimensions apply to the flat section of the lead between 0.08

mm and 0.15mm from the lead tip.

1.30

0.54 REF

1.90 BSC

This drawing is for general information only. Refer to JEDEC Drawing

TO-236, Variation AB for additional information.

0.30

0.50

12/11/09

TITLE

REV.

GPC

DRAWING NO.

Package Drawing Contact:

packagedrawings@atmel.com

3TS1, 3-lead, 1.30mm Body, Plastic Thin

Shrink Small Outline Package (Shrink SOT)

TBG

3TS1

8595F–SMEM–8/10

1...16 17 181920 21 22 23

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