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AS4C1M16S-7TCN PDF预览

AS4C1M16S-7TCN

更新时间: 2024-01-06 13:28:06
品牌 Logo 应用领域
ALSC 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
54页 1530K
描述
1M x 16 bit Synchronous DRAM (SDRAM)

AS4C1M16S-7TCN 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TSOP2
包装说明:TSOP2,针数:50
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.02Factory Lead Time:8 weeks
风险等级:1.66访问模式:DUAL BANK PAGE BURST
最长访问时间:5.4 ns其他特性:AUTO/SELF REFRESH
JESD-30 代码:R-PDSO-G50长度:20.95 mm
内存密度:16777216 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:16功能数量:1
端口数量:1端子数量:50
字数:1048576 words字数代码:1000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

AS4C1M16S-7TCN 数据手册

 浏览型号AS4C1M16S-7TCN的Datasheet PDF文件第4页浏览型号AS4C1M16S-7TCN的Datasheet PDF文件第5页浏览型号AS4C1M16S-7TCN的Datasheet PDF文件第6页浏览型号AS4C1M16S-7TCN的Datasheet PDF文件第8页浏览型号AS4C1M16S-7TCN的Datasheet PDF文件第9页浏览型号AS4C1M16S-7TCN的Datasheet PDF文件第10页 
AS4C1M16S-C&I  
Operation Mode  
Fully synchronous operations are performed to latch the commands at the positive edges of CLK. Table  
4 shows the truth table for the operation commands.  
Table 4. Truth Table (Note (1), (2))  
Command  
BankActivate  
State CKEn-1 CKEn DQM(6) A11 A10 A0-9 CS# RAS# CAS# WE#  
Idle(3)  
Any  
H
H
H
H
H
H
H
H
H
H
H
H
H
L
X
X
X
X
X
X
X
X
X
X
X
H
L
X
X
X
V
V
V
V
X
X
X
X
X
X
X
V
V
X
V
V
V
V
V
V
X
X
V
V
V
V
L
L
L
L
L
L
L
L
L
L
H
L
L
H
L
H
L
H
L
X
H
L
X
X
L
L
H
H
H
L
H
L
BankPrecharge  
PrechargeAll  
L
Any  
H
L
L
Write  
Active(3)  
Active(3)  
Active(3)  
Active(3)  
Idle  
L
H
H
H
H
L
L
Write and AutoPrecharge  
Read  
H
L
L
L
L
H
H
L
Read and Autoprecharge  
Mode Register Set  
No-Operation  
H
L
OP code  
L
Any  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
H
H
X
L
H
H
X
L
H
L
Burst Stop  
Active(4)  
Device Deselect  
AutoRefresh  
Any  
X
H
H
X
H
X
V
Idle  
SelfRefresh Entry  
SelfRefresh Exit  
Idle  
L
L
Idle  
H
X
H
X
V
X
H
X
V
(SelfRefresh)  
Clock Suspend Mode Entry  
Power Down Mode Entry  
Active  
Any(5)  
Active  
H
H
L
L
X
X
X
X
X
X
X
X
X
H
X
X
H
X
X
X
H
X
X
H
X
X
X
H
X
X
H
X
X
Clock Suspend Mode Exit  
Power Down Mode Exit  
L
L
H
H
X
X
X
X
X
X
X
X
Any  
(PowerDown)  
Data Write/Output Enable  
Data Mask/Output Disable  
Active  
Active  
H
H
X
X
L
X
X
X
X
X
X
H
Note: 1. V=Valid, X=Don't Care, L=Low level, H=High level  
2. CKEn signal is input level when commands are provided.  
CKEn-1 signal is input level one clock cycle before the commands are provided.  
3. These are states of bank designated by A11 signal.  
4. Device state is 1, 2, 4, 8, and full page burst operation.  
5. Power Down Mode can not enter in the burst operation.  
When this command is asserted in the burst cycle, device state is clock suspend mode.  
6. LDQM and UDQM  
Confidential  
6
Rev. 2.0  
March /2015  

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