AS3668
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
-0.3
-0.3
-0.3
-0.3
Max
7
Units
Comments
VBAT, VCP, CN, CP to GND
VCP to GND
V
V
V
V
7
Protection diode between VCP and GND
LED1, LED2, CURR3, CURR4 to GND
SCL, SDA, GPIO/AUDIO_IN to GND
7
7
Input Pin Current without causing
latch up
-100
+100
mA
At 25ºC, Norm: EIA/JESD78
JEDEC JESD22-A114
Electrostatic Discharge
ESD HBM (CURR1 to CURR4)
ESD HBM (all other pins)
ESD MM
2
kV
kV
V
2
100
500
JEDEC JESD22-A115
JEDEC JESD22-C101
ESD CDM
V
Storage Temperature Range
Temperature Ranges and Storage Conditions
-55
+125
ºC
Internally limited (over temperature protection)1
Continuous Power Dissipation
Storage Temperature Range
0.83
+125
60
W
ºC
-55
5
2
°C/W
%
Junction to Ambient Thermal Resistance (JA
)
Humidity non-condensing
85
Moisture Sensitive Level
1
Represents a max. floor life time of unlimited.
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
Package Body Temperature
+260
ºC
1. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 140°C (typ.) and
disengages at TJ = 135°C (typ.).
2. Junction to ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
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