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AS3668-BWLT PDF预览

AS3668-BWLT

更新时间: 2022-05-11 01:13:01
品牌 Logo 应用领域
艾迈斯 - AMSCO 控制器
页数 文件大小 规格书
59页 1090K
描述
4 Channel Breathlight Controller

AS3668-BWLT 数据手册

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AS3668  
Data Sheet - Absolute Maximum Ratings  
5 Absolute Maximum Ratings  
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of  
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect device reliability.  
Table 2. Absolute Maximum Ratings  
Parameter  
Min  
-0.3  
-0.3  
-0.3  
-0.3  
Max  
7
Units  
Comments  
VBAT, VCP, CN, CP to GND  
VCP to GND  
V
V
V
V
7
Protection diode between VCP and GND  
LED1, LED2, CURR3, CURR4 to GND  
SCL, SDA, GPIO/AUDIO_IN to GND  
7
7
Input Pin Current without causing  
latch up  
-100  
+100  
mA  
At 25ºC, Norm: EIA/JESD78  
JEDEC JESD22-A114  
Electrostatic Discharge  
ESD HBM (CURR1 to CURR4)  
ESD HBM (all other pins)  
ESD MM  
2
kV  
kV  
V
2
100  
500  
JEDEC JESD22-A115  
JEDEC JESD22-C101  
ESD CDM  
V
Storage Temperature Range  
Temperature Ranges and Storage Conditions  
-55  
+125  
ºC  
Internally limited (over temperature protection)1  
Continuous Power Dissipation  
Storage Temperature Range  
0.83  
+125  
60  
W
ºC  
-55  
5
2
°C/W  
%
Junction to Ambient Thermal Resistance (JA  
)
Humidity non-condensing  
85  
Moisture Sensitive Level  
1
Represents a max. floor life time of unlimited.  
The reflow peak soldering temperature (body  
temperature) specified is in accordance with IPC/  
JEDEC J-STD-020 “Moisture/Reflow Sensitivity  
Classification for Non-Hermetic Solid State Surface  
Mount Devices”.  
Package Body Temperature  
+260  
ºC  
1. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 140°C (typ.) and  
disengages at TJ = 135°C (typ.).  
2. Junction to ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power  
dissipation exists, special care must be paid to thermal dissipation issues in board design.  
www.ams.com/AS3668  
Revision 1.13  
6 - 59  

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