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AS29LV016BRG-100/XT PDF预览

AS29LV016BRG-100/XT

更新时间: 2024-01-16 06:26:31
品牌 Logo 应用领域
AUSTIN 闪存内存集成电路光电二极管
页数 文件大小 规格书
40页 402K
描述
16 Megabit (2M x 8-Bit / 1M x 16-Bit) CMOS 3.0 Volt-Only Boot Sector Flash Memory

AS29LV016BRG-100/XT 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:TSOP1-48
针数:48Reach Compliance Code:compliant
ECCN代码:3A001.A.2.CHTS代码:8542.32.00.51
风险等级:5.25Is Samacsys:N
最长访问时间:100 ns其他特性:BOTTOM BOOT BLOCK
备用内存宽度:8启动块:BOTTOM
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:R-PDSO-G48
JESD-609代码:e4长度:18.4 mm
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:1,2,1,31端子数量:48
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:1MX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
电源:3/3.3 V编程电压:3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:16K,8K,32K,64K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.035 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:PALLADIUM GOLD
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL切换位:YES
类型:NOR TYPE宽度:12 mm
Base Number Matches:1

AS29LV016BRG-100/XT 数据手册

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COTS PEM  
BOOT SECTOR FLASH  
Austin Semiconductor, Inc.  
AS29LV016  
DEVICE BUS OPERATIONS  
This section describes the requirements and use of the device bus operations, which are initiated through the internal  
command register. The command register itself does not occupy any addressable memory location. The register is  
com-posed of latches that store the commands, along with the address and data information needed to execute the  
command. The contents of the register serve as inputs to the internal state machine. The state machine outputs  
dictate the function of the device. Table 1 lists the device bus operations, the inputs and control levels they require, and  
the resulting output. The following subsections describe each of these operations in further detail.  
Table 1: AS29LV016 Device Bus Operations  
DQ8-DQ15  
DQ0-  
DQ7  
DOUT  
BYTE#  
=VIH  
BYTE#  
=VIL  
Address1  
AIN  
Operation  
CE#  
L
OE#  
L
WE#  
H
RESET#  
DOUT  
Read  
H
H
DQ8-DQ14= High Z,  
DQ15=A-1  
AIN  
DIN  
DIN  
Write  
L
H
L
Standby  
Vcc 0.3V  
X
H
X
X
H
X
Vcc 0.3V  
X
X
X
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
Output Disable  
Reset  
L
H
L
X
Sector Protect2  
VID  
DIN  
L
H
L
X
X
Sector Address,  
A6=L, A1=H, A0=L  
Sector Unprotect2  
Temporary Sector Unprotect  
Legend:  
VID  
VID  
DIN  
DIN  
L
H
X
L
X
X
Sector Address,  
A6=H, A1=H, A0=L  
AIN  
DIN  
X
X
High-Z  
L= Logic Low = V IL , H=Logic High=V IH , V ID =12.0 0.ꢀV, ꢁ=Donꢂt Care, A IN =Address In, D IN = Data In, D OUT =Data Out  
Notes:  
1. Addresses are A19:A0 in word mode (BYTE# = VIH ), A19:A-1 in byte mode (BYTE# = VIL  
)
2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See Sector Protection /  
Unprotection on page 11.  
WORD / BYTE CONFIGURATION  
The BYTE# pin controls whether the device data I/O pins DQ15–DQ0 operate in the byte or word  
configuration. If the BYTE# pin is set at logic 1, the device is in word configuration, DQ15–DQ0 are  
active and controlled by CE# and OE#.  
If the BYTE# pin is set at logic 0, the device is in byte configuration, and only data I/O pins DQ0–  
DQ7 are active and controlled by CE# and OE#. The data I/O pins DQ8–DQ14 are tri-stated, and  
the DQ15 pin is used as an input for the LSB (A-1) address function.  
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.  
AS29LV016  
Rev. 2.1 10/08  
6

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