APX823/APX824/APX825A
PROCESSOR SUPERVISORY CIRCUITS
Electrical Characteristics (Continued)
(Over recommended operating ambient temperature range, unless otherwise noted)
Symbol
Parameter
Test Conditions Min Typ. Max
Unit
APX823/APX824/APX825A -23
APX823/APX824/APX825A -26
APX823/APX824/APX825A -29
APX823/APX824/APX825A -31
APX823/APX824/APX825A -40
APX823/APX824/APX825A -44
APX823/APX824/APX825A -46
APX823/APX824/APX825A -23
APX823/APX824/APX825A -26
APX823/APX824/APX825A -29
APX823/APX824/APX825A -31
APX823/APX824/APX825A -40
APX823/APX824/APX825A -44
APX823/APX824/APX825A -46
APX823/APX824/APX825A -23
APX823/APX824/APX825A -26
APX823/APX824/APX825A -29
APX823/APX824/APX825A -31
APX823/APX824/APX825A -40
APX823/APX824/APX825A -44
APX823/APX824/APX825A -46
VCC = VTH to (VTH – 100mV)
2.21 2.25 2.30
2.59 2.63 2.69
2.88 2.93 3.00
o
o
3.02 3.08 3.15
3.93 4.00 4.08
4.31 4.38 4.47
4.56 4.63 4.72
2.20 2.25 2.30
2.57 2.63 2.69
2.86 2.93 3.00
3.00 3.08 3.15
3.92 4.00 4.08
4.29 4.38 4.47
4.54 4.63 4.72
TA = 0 C -85 C
V
Negative-going
Input Threshold
Voltage
VTH-
(see Note 4)
o
o
TA= -40 C -85 C
V
-
-
50
-
-
Hysteresis at
VCC Input
Vhys
mV
50
20
TS
Set-up Time
Average
μs
WDI=VCC
,
IIH(AV) High-level Input
Current
Time average
(dc=88%)
WDI=0.3V,
VCC=5.5V time
average
-
-
120
-
-
μA
WDI
Average
IIL(AV) Low-level Input
Current
-15
μA
(dc=12%)
High-level Input
Current
Low-level Input
Current
IIH
WDI
WDI
WDI=VCC
-
-
120
120
160
160
μA
μA
WDI=0.3V,
VCC=5.5V
IIL
WDI and MR
Unconnected, Outputs
unconnected
ICC
Supply Current
VCC
=
VTH-+0.2V
-
-
-
30
40
μA
60
50
5
-
-
-
kΩ
ppm/oC
pF
Internal Pull-up Resistor at MR
VOUT Temperature Coefficient
TC
Ci
VI = 0V to 5.5V
Input Capacitance at MR , WDI
SOT25 (Note 6)
SOT26 (Note 6)
SOT25 (Note 6)
SOT26 (Note 6)
161
169
27
θJA
θJC
Thermal Resistance Junction-to-Ambient
oC/W
oC/W
Thermal Resistance Junction-to-Case
28
Notes:
4. To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1μF) should be placed near the supply terminals.
5. The RESET short-circuit current is the maximum pull-up current when RESET is driven low by a P bidirectional reset pin.
6. Test condition for SOT25 and SOT26: Devices mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
APX823/APX824/APX825A Rev. 3
5 of 12
FEBRUARY 2009
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