Advanced Power
Electronics Corp.
APU1150
Stability
Assuming, the following conditions:
The APU1150 requires the use of an output capacitor as
part of the frequency compensation in order to make the
regulator stable. Typical designs for the microprocessor
applications use standard electrolytic capacitors with
typical ESR in the range of 50 to 100mΩ and an output
VOUT = 2.7V
VIN = 3.3V
VCTRL = 5V
IOUT = 2A (DC Avg)
capacitance of 500 to 1000µF. Fortunately as the ca- Calculate the maximum power dissipation using the fol-
pacitance increases, the ESR decreases resulting in a lowing equation:
fixed RC time constant. The APU1150 takes advantage
IOUT
of this phenomena in making the overall regulator loop
stable.
PD = IOUT×(VIN - VOUT)+
×(VCTRL - VOUT)
( 60 )
2
PD = 2×(3.3 - 2.7)+
×(5 - 2.7) = 1.28W
(60)
For most applications a minimum of 100µF aluminum
electrolytic capacitor such as Sanyo, MVGX series,
Panasonic FA series as well as the Nichicon PL series Using table below select the proper package and the
insures both stability and good transient response.
amount of copper board needed.
Thermal Design
Pkg
Copper θJA(°C/W)
Max Pd Max Pd
The APU1150 incorporates an internal thermal shutdown
Area
(TA=25°C)
4.4W
(TA=45°C)
3.6W
that protects the device when the junction temperature TO-263 1.4"X1.4"
exceeds the allowable maximum junction temperature. TO-263 1.0"X1.0"
Although this device can operate with junction tempera- TO-263 0.7"X0.7"
tures in the range of 150ꢀC, it is recommended that the TO-263 Pad Size
selected heat sink be chosen such that during maxi- SO-8 1.0"X1.0"
mum continuous load operation the junction tempera-
25
30
35
45
55
3.7W
3.0W
3.1W
2.6W
2.4W
2.0W
2.0W
1.63W
ture is kept below this number. The example below Note: Above table is based on the maximum junction
shows the steps in selecting the proper surface mount temperature of 135ꢀC.
package.
As shown in the above table, any of the two packages
will do the job. For low cost applications the SOIC 8-pin
package is recommended.
5/5