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APU1150M PDF预览

APU1150M

更新时间: 2024-02-07 04:26:12
品牌 Logo 应用领域
富鼎先进 - A-POWER /
页数 文件大小 规格书
5页 175K
描述
APU1150M

APU1150M 技术参数

生命周期:ObsoleteReach Compliance Code:compliant
风险等级:5.84Base Number Matches:1

APU1150M 数据手册

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Advanced Power  
Electronics Corp.  
APU1150  
Stability  
Assuming, the following conditions:  
The APU1150 requires the use of an output capacitor as  
part of the frequency compensation in order to make the  
regulator stable. Typical designs for the microprocessor  
applications use standard electrolytic capacitors with  
typical ESR in the range of 50 to 100mand an output  
VOUT = 2.7V  
VIN = 3.3V  
VCTRL = 5V  
IOUT = 2A (DC Avg)  
capacitance of 500 to 1000µF. Fortunately as the ca- Calculate the maximum power dissipation using the fol-  
pacitance increases, the ESR decreases resulting in a lowing equation:  
fixed RC time constant. The APU1150 takes advantage  
IOUT  
of this phenomena in making the overall regulator loop  
stable.  
PD = IOUT×(VIN - VOUT)+  
×(VCTRL - VOUT)  
( 60 )  
2
PD = 2×(3.3 - 2.7)+  
×(5 - 2.7) = 1.28W  
(60)  
For most applications a minimum of 100µF aluminum  
electrolytic capacitor such as Sanyo, MVGX series,  
Panasonic FA series as well as the Nichicon PL series Using table below select the proper package and the  
insures both stability and good transient response.  
amount of copper board needed.  
Thermal Design  
Pkg  
Copper θJA(°C/W)  
Max Pd Max Pd  
The APU1150 incorporates an internal thermal shutdown  
Area  
(TA=25°C)  
4.4W  
(TA=45°C)  
3.6W  
that protects the device when the junction temperature TO-263 1.4"X1.4"  
exceeds the allowable maximum junction temperature. TO-263 1.0"X1.0"  
Although this device can operate with junction tempera- TO-263 0.7"X0.7"  
tures in the range of 150C, it is recommended that the TO-263 Pad Size  
selected heat sink be chosen such that during maxi- SO-8 1.0"X1.0"  
mum continuous load operation the junction tempera-  
25  
30  
35  
45  
55  
3.7W  
3.0W  
3.1W  
2.6W  
2.4W  
2.0W  
2.0W  
1.63W  
ture is kept below this number. The example below Note: Above table is based on the maximum junction  
shows the steps in selecting the proper surface mount temperature of 135C.  
package.  
As shown in the above table, any of the two packages  
will do the job. For low cost applications the SOIC 8-pin  
package is recommended.  
5/5  

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