AMS317
Table 1.
COPPER AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
TOP SIDE*
2500 Sq. mm
BACK SIDE
2500 Sq. mm
BOARD AREA
2500 Sq. mm
45°C/W
45°C/W
53°C/W
59°C/W
52°C/W
55°C/W
1000 Sq. mm
225 Sq. mm
100 Sq. mm
1000 Sq. mm
1000 Sq. mm
2500 Sq. mm
2500 Sq. mm
2500 Sq. mm
1000 Sq. mm
0
2500 Sq. mm
2500 Sq. mm
2500 Sq. mm
1000 Sq. mm
1000 Sq. mm
* Tab of device attached to topside copper.
TYPICAL PERFORMANCE CHARACTERISTICS
Minimum Operating Current
Short-Circuit Current
(Adjustable Device)
12
1.25
1.00
0.75
0.50
0.25
0
TJ = 125°C
TJ = 25°C
9
TJ =
125°C
TJ = 25°C
6
3
0
0
5
10
15
20
0
5
10
15
INPUT/OUTPUT DIFFERENTIAL
INPUT/OUTPUT DIFFERENTIAL (V)
Load Regulation
Ripple Rejection vs. Current
0.10
0.05
100
90
80
70
60
50
40
30
20
10
0
D
ILOAD = 1A
fRIPPLE = 120Hz
VRIPPLE£3Vp-p
0
fRIPPLE = 20Hz
-0.05
£
VRIPPLE 0.5Vp-p
-0.10
-0.15
-0.20
VOUT = 5V
CADJ = 25
COUT = 25
mF
m
F
-50
-25
0
25
50
75
100
125
0
0.2
0.4
0.6
0.8
TEMPERATURE (°C)
OUTPUT CURRENT (A)
Advanced Monolithic Systems, Inc. 6680B Sierra Lane, Dublin, CA 94568 Phone (925) 556-9090 Fax (925) 556-9140