AMMP-6220

更新时间： 2024-01-07 00:58:15

品牌	Logo	应用领域
安捷伦 - AGILENT		射频和微波射频放大器微波放大器
页数	文件大小	规格书
10页	399K
描述
6-20 GHz Low Noise Amplifier

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中文翻译

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技术参数
数据手册
替代型号

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AMMP-6220 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	LCC8,.2SQ,28	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.33.00.01
风险等级：	7.54	特性阻抗：	50 Ω
构造：	COMPONENT	增益：	22 dB
最大输入功率 (CW)：	15 dBm	JESD-609代码：	e4
安装特点：	SURFACE MOUNT	功能数量：	1
端子数量：	8	最大工作频率：	20000 MHz
最小工作频率：	6000 MHz	封装主体材料：	PLASTIC/EPOXY
封装等效代码：	LCC8,.2SQ,28	电源：	3 V
射频/微波设备类型：	WIDE BAND LOW POWER	子类别：	RF/Microwave Amplifiers
最大压摆率：	70 mA	表面贴装：	YES
端子面层：	Nickel/Gold (Ni/Au)	Base Number Matches：	1

AMMP-6220 数据手册

300

250

Solder Reflow Profile

PEAK = 250 5°C

The most commonly used solder

reflow method is accomplished in

a belt furnace using convection

heat transfer. The suggested

reflow profile for automated

reflow processes is shown in

Figure 25. This profile is designed

to ensure reliable finished joints.

However, the profile indicated in

Figure 25 will vary among differ-

ent solder pastes from different

manufacturers and is shown here

for reference only.

MELTING POINT = 218°C

200

150

100

RAMP 1

PREHEAT

RAMP 2

REFLOW

COOLING

250

100

150

200

300

TIME (SECONDS)

Figure 25. Suggested lead-free reflow profile for SnAgCu solder paste.

0.70

Stencil Design Guidelines

A properly designed solder screen

or stencil is required to ensure

optimum amount of solder paste

is deposited onto the PCB pads.

The recommended stencil layout

is shown in Figure 26. The stencil

has a solder paste deposition

opening approximately 70% to

90% of the PCB pad. Reducing

stencil opening can potentially

generate more voids underneath.

On the other hand, stencil open-

ings larger than 100% will lead to

excessive solder paste smear or

bridging across the I/O pads.

Considering the fact that solder

paste thickness will directly affect

the quality of the solder joint, a

good choice is to use a laser cut

stencil composed of 0.127 mm

(5 mils) thick stainless steel which

is capable of producing the re-

quired fine stencil outline. The

combined PCB and stencil layout

is shown in Figure 27.

0.60

1.60

0.9550

0.95

0.36

1.80

0.27

0.36

0.40

4x – R0.14

Figure 26. Stencil outline drawing (mm).

0.40

0.46

0.67

0.60

0.36

0.40

3.20 1.80 0.40

0.30

0.36

0.27

STENCIL

OPENING

1.60

2.90

Figure 27. Combined PCB and stencil layouts (mm).

1...5 6 789 10

中文翻译

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AMMP-6220 替代型号

型号	品牌	替代类型	描述	数据表
AMMP-6220	AGILENT	当前型号	6-20 GHz Low Noise Amplifier
AMMP-6220-BLK	AVAGO	功能相似	6-20 GHz Low Noise Amplifier

与AMMP-6220相关器件

型号	品牌	描述	获取价格	数据表
AMMP-6220-BLK	AGILENT	6-20 GHz Low Noise Amplifier	获取价格
AMMP-6220-BLK	AVAGO	6-20 GHz Low Noise Amplifier	获取价格
AMMP-6220-TR1	AVAGO	6-20 GHz Low Noise Amplifier	获取价格
AMMP-6220-TR1	AGILENT	6-20 GHz Low Noise Amplifier	获取价格
AMMP-6220-TR2	AGILENT	6-20 GHz Low Noise Amplifier	获取价格
AMMP-6220-TR2	AVAGO	6-20 GHz Low Noise Amplifier	获取价格