AMIS-30622
3. Pin-out
1
2
20
19
18
17
16
15
14
13
12
11
SDA
SCK
VDD
GND
TST1
TST2
GND
HW
SWI
VBB
3
MOTXP
GND
4
5
MOTXN
MOTYP
GND
6
7
8
MOTYN
VBB
9
CPN
CPP
10
VCP
SOIC-20
Pin name
Pin description
SOIC-20
SDA
SCK
Serial I/O
Clock for SDA
1
2
VDD
GND
Internal supply (needs external decoupling capacitor)
Ground, heat sink
3
4,7,14,17
TST1
TST2
HW
test pin (to be tied to ground in normal operation)
test pin (to be left open in normal operation)
Hardwired address bit
5
6
8
CPN
CPP
VCP
VBB
MOTYN
MOTYP
MOTXN
MOTXP
SWI
Negative connection of pump-capacitor (charge pump)
Positive connection of pump-capacitor (charge pump)
Charge-pump filter-capacitor
Battery voltage supply
Negative end of phase Y coil
Positive end of phase Y coil
Negative end of phase X coil
Positive end of phase X coil
Switch input
9
10
11
12, 19
13
15
16
18
20
4. Package thermal resistance
4.1. SO20
2 × (10mm × 23mm)
The junction-case thermal resistance is 28°C/W,
leading to a junction-ambient thermal resistance of
63°C/W, with the PCB ground plane layout condition
given on the figure beside, and with:
•
•
•
PCB thickness = 1.6mm
1 layer
Copper thickness = 35µm
Rev. 3 | Page 7 of 42 | www.onsemi.com