AMIS-30622
9.2.2.12. Application parameters stored in OTP Memory...............................................28
9.2.2.13. OTP Memory Structure ....................................................................................29
9.2.3.
Motordriver...............................................................................................................30
9.2.3.1. Current waveforms in the coils...........................................................................30
9.2.3.2. PWM regulation..................................................................................................30
9.2.3.3. Motor starting phase ..........................................................................................30
9.2.3.4. Motor stopping phase.........................................................................................31
9.2.3.5. Charge pump monitoring....................................................................................31
9.2.3.6. Electrical defect on coils, detection and confirmation........................................31
9.2.4.
Inter-IC Control (I²C) bus.........................................................................................32
9.2.4.1. Physical layer .....................................................................................................32
9.2.4.2. Communication on 2-wire serial bus interface...................................................32
9.2.4.3. Physical Address of the circuit...........................................................................33
9.2.4.4. Write data to AMIS-30622..................................................................................33
9.2.4.5. Read data from AMIS-30622 .............................................................................33
9.2.4.6. Timing and electrical characteristics of the serial interface ...............................34
9.2.4.7. Description of Application Commands...............................................................34
9.2.4.8. Command Overview...........................................................................................34
9.2.4.9. Commands Description......................................................................................35
10. Features ...............................................................................................................................40
10.1. Position periodicity.........................................................................................................40
11. Resistance to electrical and electromagnetic disturbances ..........................................41
11.1. Electrostatic discharges.................................................................................................41
11.2. Schäffner pulses ............................................................................................................41
11.3. EMC ...............................................................................................................................41
11.4. EMI.................................................................................................................................41
11.5. Power supply micro-interruptions ..................................................................................41
12. Packages Outline ................................................................................................................42
13. Conditioning ........................................................................................................................42
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