Datasheet > AM50DL128BG70FS

AM50DL128BG70FS

更新时间： 2024-02-03 11:30:15

品牌	Logo	应用领域
飞索 - SPANSION		静态存储器内存集成电路
页数	文件大小	规格书
64页	978K
描述
Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73

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AM50DL128BG70FS 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	LFBGA,
针数：	73	Reach Compliance Code：	compliant
HTS代码：	8542.32.00.71	风险等级：	5.12
Is Samacsys：	N	其他特性：	PSEUDO SRAM IS ORGANISED AS 2M X 16
JESD-30 代码：	R-PBGA-B73	JESD-609代码：	e1
长度：	11.6 mm	内存密度：	67108864 bit
内存集成电路类型：	MEMORY CIRCUIT	内存宽度：	16
湿度敏感等级：	3	功能数量：	1
端子数量：	73	字数：	4194304 words
字数代码：	4000000	工作模式：	ASYNCHRONOUS
最高工作温度：	85 °C	最低工作温度：	-40 °C
组织：	4MX16	封装主体材料：	PLASTIC/EPOXY
封装代码：	LFBGA	封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, LOW PROFILE, FINE PITCH	峰值回流温度（摄氏度）：	260
认证状态：	Not Qualified	座面最大高度：	1.4 mm
最大供电电压 (Vsup)：	3.3 V	最小供电电压 (Vsup)：	2.7 V
标称供电电压 (Vsup)：	3 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子面层：	TIN SILVER COPPER	端子形式：	BALL
端子节距：	0.8 mm	端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	40	宽度：	8 mm
Base Number Matches：	1

Am50DL128BG

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number 26089 Revision A Amendment +3 Issue Date January 8, 2002

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型号	品牌	描述	获取价格	数据表
AM50DL128BG70FT	SPANSION	Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	获取价格
AM50DL128BG70I	AMD	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM	获取价格
AM50DL128BG70IS	SPANSION	Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	获取价格
AM50DL128BG70IT	SPANSION	Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	获取价格
AM50DL128BG85FS	SPANSION	Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	获取价格
AM50DL128BG85FT	SPANSION	Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	获取价格