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AM29DL640H90WHIN PDF预览

AM29DL640H90WHIN

更新时间: 2024-01-03 12:58:50
品牌 Logo 应用领域
超微 - AMD 闪存
页数 文件大小 规格书
54页 881K
描述
64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory

AM29DL640H90WHIN 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:not_compliant风险等级:5.92
最长访问时间:90 ns备用内存宽度:8
启动块:BOTTOM/TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B63JESD-609代码:e0
内存密度:67108864 bit内存集成电路类型:FLASH
内存宽度:16湿度敏感等级:3
部门数/规模:16,126端子数量:63
字数:4194304 words字数代码:4000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX16封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA63,8X12,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, FINE PITCH
并行/串行:PARALLEL电源:3/3.3 V
认证状态:Not Qualified就绪/忙碌:YES
部门规模:8K,64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.045 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM切换位:YES
类型:NOR TYPEBase Number Matches:1

AM29DL640H90WHIN 数据手册

 浏览型号AM29DL640H90WHIN的Datasheet PDF文件第48页浏览型号AM29DL640H90WHIN的Datasheet PDF文件第49页浏览型号AM29DL640H90WHIN的Datasheet PDF文件第50页浏览型号AM29DL640H90WHIN的Datasheet PDF文件第51页浏览型号AM29DL640H90WHIN的Datasheet PDF文件第52页浏览型号AM29DL640H90WHIN的Datasheet PDF文件第53页 
REVISION SUMMARY  
Revision A (November 11, 2002)  
Revision A+4 (May 10, 2004)  
Initial release.  
Updated preliminary to datasheet status.  
Added additional header information on first page of  
datasheet.  
Revision A+1 (August 29, 2003)  
Am29DL640H  
Revision A+5 (July 12, 2004)  
Converted to preliminary datasheet.  
Table 5, “Am29DL640H Autoselect Codes, (High  
Voltage Method),on page 14.  
Distinctive Characteristics and Physical  
Dimensions  
Replaced “80h (factory locked),40h (customer locked),  
00h (not factory/customer locked)” with “81h (factory  
locked),01h (customer and factory locked)”.  
Removed 48-ball fine pitch BGA and 64-ball fortified  
BGA.  
Added 63-ball fine pitch BGA.  
Table 12, “Am29DL640H Command Definitions,on  
page 27  
Ordering Information  
In Secured Silicon Sector Factory Protect row, Data  
column - Replaced “80/00” with “81/01”.  
Changed package type from WC to WH and removed  
PC package.  
(Note 10) Replaced “The data is 80h for factory  
locked, 40h for customer locked, and 00h for not fac-  
tory/customer locked” with “The data is 81h for factory  
locked, 40h for customer locked, and 01h for not fac-  
tory/customer locked”.  
Table 6, Am29DL640H Boot Sector/Sector Block  
Addresses for Protection/Unprotection  
Modified the SA140 address.  
Revision A+2 (October 24, 2003)  
Revision A+6 (February 9, 2005)  
Table 11, Primary Vendor-Specific Extended Query  
Connection Diagrams  
Corrected definitions for data at address 4Fh.  
Updated the 63-ball FBGA diagram.  
Revision A+3 (November 26, 2003)  
DC Characteristics table  
Changed VOL maximum specification from 4 mA to 2  
mA.  
Colophon  
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-  
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-  
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the  
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,  
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for  
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to  
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor de-  
vices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design mea-  
sures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating  
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign  
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-  
thorization by the respective government entity will be required for export of those products  
Trademarks  
Copyright ©2002-2005 Advanced Micro Devices, Inc. All rights reserved.  
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.  
ExpressFlash is a trademark of Advanced Micro Devices, Inc.  
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.  
52  
Am29DL640H  
February 9, 2005  

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