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AM29DL640G70 PDF预览

AM29DL640G70

更新时间: 2024-01-30 18:24:39
品牌 Logo 应用领域
超微 - AMD 闪存
页数 文件大小 规格书
52页 1124K
描述
64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory

AM29DL640G70 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.8
最长访问时间:70 ns备用内存宽度:8
启动块:BOTTOM/TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B63JESD-609代码:e0
内存密度:67108864 bit内存集成电路类型:FLASH
内存宽度:16湿度敏感等级:3
部门数/规模:16,126端子数量:63
字数:4194304 words字数代码:4000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX16封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA63,8X12,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, FINE PITCH
并行/串行:PARALLEL电源:3/3.3 V
认证状态:Not Qualified就绪/忙碌:YES
部门规模:8K,64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.045 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM切换位:YES
类型:NOR TYPEBase Number Matches:1

AM29DL640G70 数据手册

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PRELIMINARY  
Am29DL640G  
64 Megabit (8 M x 8-Bit/4 M x 16-Bit)  
CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory  
DISTINCTIVE CHARACTERISTICS  
Ultra low power consumption (typical values)  
ARCHITECTURAL ADVANTAGES  
— 2 mA active read current at 1 MHz  
— 10 mA active read current at 5 MHz  
— 200 nA in standby or automatic sleep mode  
Simultaneous Read/Write operations  
— Data can be continuously read from one bank while  
executing erase/program functions in another bank.  
— Zero latency between read and write operations  
Minimum 1 million write cycles guaranteed per  
sector  
20 year data retention at 125°C  
— Reliable operation for the life of the system  
Flexible BankTM architecture  
— Read may occur in any of the three banks not being  
written or erased.  
— Four banks may be grouped by customer to achieve  
desired bank divisions.  
SOFTWARE FEATURES  
Data Management Software (DMS)  
— AMD-supplied software manages data programming,  
enabling EEPROM emulation  
Boot Sectors  
Top and bottom boot sectors in the same device  
— Any combination of sectors can be erased  
— Eases historical sector erase flash limitations  
Manufactured on 0.17 µm process technology  
Supports Common Flash Memory Interface (CFI)  
Erase Suspend/Erase Resume  
SecSi™ (Secured Silicon) Sector: Extra 256 Byte  
sector  
— Suspends erase operations to allow reading from  
other sectors in same bank  
Factory locked and identifiable: 16 bytes available for  
secure, random factory Electronic Serial Number;  
verifiable as factory locked through autoselect  
function. ExpressFlash option allows entire sector to  
be available for factory-secured data  
Data# Polling and Toggle Bits  
— Provides a software method of detecting the status of  
program or erase cycles  
Unlock Bypass Program command  
— Reduces overall programming time when issuing  
multiple program command sequences  
Customer lockable: One-time programmable only.  
Once locked, data cannot be changed  
Zero Power Operation  
HARDWARE FEATURES  
— Sophisticated power management circuits reduce  
power consumed during inactive periods to nearly  
zero.  
Ready/Busy# output (RY/BY#)  
— Hardware method for detecting program or erase  
cycle completion  
Compatible with JEDEC standards  
Hardware reset pin (RESET#)  
— Hardware method of resetting the internal state  
machine to the read mode  
— Pinout and software compatible with  
single-power-supply flash standard  
PACKAGE OPTIONS  
WP#/ACC input pin  
— Write protect (WP#) function protects sectors 0, 1,  
140, and 141, regardless of sector protect status  
63-ball Fine Pitch BGA  
64-ball Fortified BGA  
48-pin TSOP  
— Acceleration (ACC) function accelerates program  
timing  
Sector protection  
PERFORMANCE CHARACTERISTICS  
— Hardware method of locking a sector, either  
in-system or using programming equipment, to  
prevent any program or erase operation within that  
sector  
High performance  
— Access time as fast as 65 ns  
— Program time: 4 µs/word typical utilizing Accelerate  
function  
Temporary Sector Unprotect allows changing data in  
protected sectors in-system  
Publication# 25693 Rev: A Amendment/+2  
Issue Date: June 7, 2002  
This document contains information on a product under development at Advanced Micro Devices. The information  
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed  
product without notice.  
Refer to AMD’s Website (www.amd.com) for the latest information.  

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