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AM29DL164DB90WCF PDF预览

AM29DL164DB90WCF

更新时间: 2024-02-10 01:47:10
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路闪存
页数 文件大小 规格书
57页 1243K
描述
Flash, 1MX16, 90ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48

AM29DL164DB90WCF 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.77
最长访问时间:90 ns备用内存宽度:8
启动块:BOTTOM命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B48内存密度:16777216 bit
内存集成电路类型:FLASH部门数/规模:8,31
端子数量:48字数:1048576 words
字数代码:1000000最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX16
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA48,6X8,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH并行/串行:PARALLEL
电源:3/3.3 V认证状态:Not Qualified
就绪/忙碌:YES部门规模:8K,64K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.045 mA表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM切换位:YES
类型:NOR TYPEBase Number Matches:1

AM29DL164DB90WCF 数据手册

 浏览型号AM29DL164DB90WCF的Datasheet PDF文件第51页浏览型号AM29DL164DB90WCF的Datasheet PDF文件第52页浏览型号AM29DL164DB90WCF的Datasheet PDF文件第53页浏览型号AM29DL164DB90WCF的Datasheet PDF文件第54页浏览型号AM29DL164DB90WCF的Datasheet PDF文件第55页浏览型号AM29DL164DB90WCF的Datasheet PDF文件第56页 
D A T A S H E E T  
Revision E + 2 (February 14, 2003)  
Revision E5 (December 1, 2006)  
Global  
Global  
Added VBF048 package, Very Thin Profile Fine Pitch  
Ball Grid Array, to Distinctive Characteristics, General  
Description, Ordering Information, Connection Dia-  
grams, and Physical Dimensions sections.  
Changed SecSi to Secured Silicon.  
Erase and Program Operations table  
Changed tBUSY to a maximum specification.  
Revision E+3 (February 25, 2004)  
Revision E6 (February 26, 2009)  
AC Characteristics  
Global  
Corrected tSR/W in Figure 20, Back-to-back Read/Write  
Cycle Timings.  
Added obsolescence information.  
Revision E+4 (May 26, 2004)  
Ordering Information  
Added Pb-Free OPNs.  
Colophon  
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-  
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-  
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the  
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,  
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for  
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to  
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor de-  
vices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design mea-  
sures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating  
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign  
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-  
thorization by the respective government entity will be required for export of those products.  
Trademarks  
Copyright © 1998–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-  
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are  
for identification purposes only and may be trademarks of their respective companies.  
Copyright © 2006-2009 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse, ORNAND,  
ORNAND2, HD-SIM, EcoRAMand combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used  
are for informational purposes only and may be trademarks of their respective owners.  
February 26, 2009 21533E6  
Am29DL16xD  
57  

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