Datasheet > AM29DL164CB120WCEN

AM29DL164CB120WCEN

更新时间： 2024-02-05 03:01:16

品牌	Logo	应用领域
飞索 - SPANSION		内存集成电路
页数	文件大小	规格书
51页	737K
描述
Flash, 2MX8, 120ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48

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AM29DL164CB120WCEN 技术参数

生命周期：	Transferred	零件包装代码：	BGA
包装说明：	8 X 9 MM, 0.80 MM PITCH, FBGA-48	针数：	48
Reach Compliance Code：	unknown	ECCN代码：	3A001.A.2.C
HTS代码：	8542.32.00.51	风险等级：	5.29
最长访问时间：	120 ns	其他特性：	CONFIGURABLE AS 1M X 16
备用内存宽度：	16	启动块：	BOTTOM
JESD-30 代码：	R-PBGA-B48	长度：	9 mm
内存密度：	16777216 bit	内存集成电路类型：	FLASH
内存宽度：	8	功能数量：	1
端子数量：	48	字数：	2097152 words
字数代码：	2000000	工作模式：	ASYNCHRONOUS
最高工作温度：	125 °C	最低工作温度：	-55 °C
组织：	2MX8	封装主体材料：	PLASTIC/EPOXY
封装代码：	TFBGA	封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, THIN PROFILE, FINE PITCH	并行/串行：	PARALLEL
编程电压：	3 V	认证状态：	Not Qualified
座面最大高度：	1.2 mm	最大供电电压 (Vsup)：	3.6 V
最小供电电压 (Vsup)：	2.7 V	标称供电电压 (Vsup)：	3 V
表面贴装：	YES	技术：	CMOS
温度等级：	MILITARY	端子形式：	BALL
端子节距：	0.8 mm	端子位置：	BOTTOM
类型：	NOR TYPE	宽度：	8 mm

AM29DL164CB120WCEN 数据手册

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P R E L I M I N A R Y

GENERAL DESCRIPTION

The Am29DL16xC family consists of 16 megabit, 3.0

volt-only flash memory devices, organized as 1,048,576

words of 16 bits each or 2,097,152 bytes of 8 bits each.

Word mode data appears on DQ0–DQ15; byte mode

data appears on DQ0–DQ7. The device is designed to

be programmed in-system with the standard 3.0 volt

V_CCsupply, and can also be programmed in standard

EPROM programmers.

other flash sector, or may permanently lock their own

code there.

DMS (Data Management Software) allows systems

to easily take advantage of the advanced architecture

of the simultaneous read/write product line by allowing

removal of EEPROM devices. DMS will also allow the

system software to be simplified, as it will perform all

functions necessary to modify data in file structures,

as opposed to single-byte modifications. To write or

update a particular piece of data (a phone number or

configuration data, for example), the user only needs

to state which piece of data is to be updated, and

where the updated data is located in the system. This

is an advantage compared to systems where

user-written software must keep track of the old data

location, status, logical to physical translation of the

data onto the Flash memory device (or memory de-

vices), and more. Using DMS, user-written software

does not need to interface with the Flash memory di-

rectly. Instead, the user's software accesses the Flash

memory by calling one of only six functions. AMD pro-

vides this software to simplify system design and

software integration efforts.

The device is available with an access time of 70, 80,

90, or 120 ns. The devices are offered in 56-pin SSOP,

48-pin TSOP, and 48-ball FBGA packages. Standard

control pins—chip enable (CE#), write enable (WE#),

and output enable (OE#)—control normal read and

write operations, and avoid bus contention issues.

The device requires only a single 3.0 volt power sup-

ply for both read and write functions. Internally

generated and regulated voltages are provided for the

program and erase operations.

Simultaneous Read/Write Operations with

Zero Latency

The Simultaneous Read/Write architecture provides

simultaneous operation by dividing the memory

space into two banks. The device can improve overall

system performance by allowing a host system to pro-

gram or erase in one bank, then immediately and

simultaneously read from the other bank, with zero la-

tency. This releases the system from waiting for the

completion of program or erase operations.

The device offers complete compatibility with the

JEDEC single-power-supply Flash command set

standard. Commands are written to the command

Reading data out of the device is similar to reading

from other Flash or EPROM devices.

The host system can detect whether a program or

erase operation is complete by using the device sta-

tus bits: RY/BY# pin, DQ7 (Data# Polling) and

DQ6/DQ2 (toggle bits). After a program or erase cycle

has been completed, the device automatically returns

to reading array data.

The Am29DL16xC device family uses multiple bank

architectures to provide flexibility for different applica-

tions. Three devices are available with the following

bank sizes:

Device

DL162

DL163

DL164

Bank 1

2 Mb

Bank 2

14 Mb

12 Mb

8 Mb

The sector erase architecture allows memory sec-

tors to be erased and reprogrammed without affecting

the data contents of other sectors. The device is fully

erased when shipped from the factory.

4 Mb

8 Mb

Am29DL16xC Features

Hardware data protection measures include a low

V_CCdetector that automatically inhibits write opera-

tions during power transitions. The hardware sector

protection feature disables both program and erase

operations in any combination of the sectors of mem-

or y. This can be achieved in-system or via

programming equipment.

The Secured Silicon (SecSi) Sector is an extra 64

Kbit sector capable of being permanently locked by

AMD or customers. The SecSi Sector Indicator Bit

(DQ7) is permanently set to a 1 if the part is factory

locked, and set to a 0 if customer lockable. This way,

customer lockable parts can never be used to replace

a factory locked part.

The device offers two power-saving features. When

addresses have been stable for a specified amount of

time, the device enters the automatic sleep mode.

The system can also place the device into the

standby mode. Power consumption is greatly re-

duced in both modes.

Factory locked parts provide several options. The

SecSi Sector may store a secure, random 16 byte

ESN (Electronic Serial Number), customer code (pro-

grammed through AMD’s ExpressFlash service), or

both. Customer Lockable parts may utilize the SecSi

Sector as bonus space, reading and writing like any

Am29DL16xC

123 4 5 6 7...51

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与AM29DL164CB120WCEN相关器件

型号	品牌	获取价格	描述	数据表
AM29DL164CB120WCFN	SPANSION	获取价格	Flash, 2MX8, 120ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
AM29DL164CB120WCIB	SPANSION	获取价格	Flash, 2MX8, 120ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
AM29DL164CB120WCIN	SPANSION	获取价格	Flash, 2MX8, 120ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
AM29DL164CB120WCKN	SPANSION	获取价格	Flash, 2MX8, 120ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
AM29DL164CB80WCFN	SPANSION	获取价格	Flash, 2MX8, 80ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
AM29DL164CB80WCIB	SPANSION	获取价格	Flash, 2MX8, 80ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
AM29DL164CB80WCIN	SPANSION	获取价格	Flash, 2MX8, 80ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
AM29DL164CB90WCFN	SPANSION	获取价格	Flash, 2MX8, 90ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
AM29DL164CB90WCIB	SPANSION	获取价格	Flash, 2MX8, 90ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
AM29DL164CB90WCIN	SPANSION	获取价格	Flash, 2MX8, 90ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48

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