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AM29DL162DT70PCI PDF预览

AM29DL162DT70PCI

更新时间: 2024-02-25 00:43:23
品牌 Logo 应用领域
超微 - AMD 闪存内存集成电路
页数 文件大小 规格书
57页 1258K
描述
16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory

AM29DL162DT70PCI 技术参数

是否Rohs认证: 符合生命周期:Transferred
Reach Compliance Code:unknown风险等级:5.79
最长访问时间:70 ns备用内存宽度:8
启动块:TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B48内存密度:16777216 bit
内存集成电路类型:FLASH内存宽度:16
部门数/规模:8,31端子数量:48
字数:1048576 words字数代码:1000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX16封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA48,6X8,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, FINE PITCH
并行/串行:PARALLEL电源:3/3.3 V
认证状态:Not Qualified就绪/忙碌:YES
部门规模:8K,64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.045 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
切换位:YES类型:NOR TYPE
Base Number Matches:1

AM29DL162DT70PCI 数据手册

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Revision E + 2 (February 14, 2003)  
Revision E+3 (February 25, 2004)  
Global  
AC Characteristics  
Added VBF048 package, Very Thin Profile Fine Pitch  
Ball Grid Array, to Distinctive Characteristics, General  
Description, Ordering Information, Connection Dia-  
grams, and Physical Dimensions sections.  
Corrected tSR/W in Figure 20, Back-to-back Read/Write  
Cycle Timings.  
Revision E+4 (May 26, 2004)  
Ordering Information  
Added Pb-Free OPNs.  
Trademarks  
Copyright © 2004 Advanced Micro Devices, Inc. All rights reserved.  
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.  
ExpressFlash is a trademark of Advanced Micro Devices, Inc.  
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.  
May 26, 2004  
Am29DL16xD  
57  

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