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AM29DL162DT70VRF PDF预览

AM29DL162DT70VRF

更新时间: 2024-01-18 02:00:51
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路闪存
页数 文件大小 规格书
57页 1243K
描述
Flash, 1MX16, 70ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, VBGA-48

AM29DL162DT70VRF 技术参数

是否Rohs认证: 符合生命周期:Transferred
Reach Compliance Code:unknown风险等级:5.82
最长访问时间:70 ns备用内存宽度:8
启动块:TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B48内存密度:16777216 bit
内存集成电路类型:FLASH内存宽度:16
部门数/规模:8,31端子数量:48
字数:1048576 words字数代码:1000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX16封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA48,6X8,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, FINE PITCH
并行/串行:PARALLEL电源:3/3.3 V
认证状态:Not Qualified就绪/忙碌:YES
部门规模:8K,64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.045 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
切换位:YES类型:NOR TYPE

AM29DL162DT70VRF 数据手册

 浏览型号AM29DL162DT70VRF的Datasheet PDF文件第2页浏览型号AM29DL162DT70VRF的Datasheet PDF文件第3页浏览型号AM29DL162DT70VRF的Datasheet PDF文件第4页浏览型号AM29DL162DT70VRF的Datasheet PDF文件第5页浏览型号AM29DL162DT70VRF的Datasheet PDF文件第6页浏览型号AM29DL162DT70VRF的Datasheet PDF文件第7页 
Am29DL16xD  
Data Sheet (Retired Product)  
Am29DL16xD Cover Sheet  
This product family has been retired and is not recommended for designs.  
For new and current designs involving TSOP packages, S29JL032H supersedes Am29DL16xD and is the factory-  
recommended migration path. Please refer to the S29JL032H data sheet for specifications and ordering information.  
For new and current designs involving Fine-pitch BGA (FBGA) packages, S29PL032J supersedes Am29DL16xD and is the  
factory-recommended migration path. Please refer to the S29PL-J data sheet for specifications and ordering information.  
Availability of this document is retained for reference and historical purposes only.  
The following document contains information on Spansion memory products.  
Continuity of Specifications  
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been  
made are the result of normal data sheet improvement and are noted in the document revision summary.  
For More Information  
Please contact your local sales office for additional information about Spansion memory solutions.  
Publication Number 21533  
Revision E  
Amendment 6  
Issue Date February 26, 2009  

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