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AM1806BZWTA3

更新时间： 2024-01-27 01:25:21

品牌	Logo	应用领域
德州仪器 - TI		微处理器
页数	文件大小	规格书
241页	1566K
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AM1806 ARM Microprocessor

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AM1806BZWTA3 数据手册

AM1806

www.ti.com

SPRS658–FEBRUARY 2010

8 Mechanical Packaging and Orderable Information

This section describes the device orderable part numbers, packaging options, materials, thermal and

mechanical parameters.

8.1 Device and Development-Support Tool Nomenclature

Figure 8-1 provides a legend for reading the complete device.

( )

AM1806

ZWT

DEVICE SPEED RANGE

PREFIX

3 = 375 MHz

4 = 456 MHz

X = Experimental Device

P = Prototype Device

Blank = Production Device

TEMPERATURE RANGE (JUNCTION)

Blank

0°C to 90°C (Commercial Grade)

-40°C to 90°C (Industrial Grade)

-40°C to 105°C (Extended Grade)

DEVICE

PACKAGE TYPE

SILICON REVISION

ZCE = 361 Pin Plastic BGA, with Pb-free

Soldered Balls [Green], 0.65-mm Ball Pitch

= Silicon Revision 2.0

ZWT = 361 Pin Plastic BGA, with Pb-free

Soldered Balls [Green]; 0.80-mm Ball Pitch

A. BGA = Ball Grid Array

Figure 8-1. Device Nomenclature

Mechanical Packaging and Orderable Information

237

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与AM1806BZWTA3相关器件

型号	品牌	描述	获取价格	数据表
AM1806BZWTA4	TI	AM1806 ARM Microprocessor	获取价格
AM1806BZWTD3	TI	AM1806 ARM Microprocessor	获取价格
AM1806BZWTD4	TI	AM1806 ARM Microprocessor	获取价格
AM1806EZCE3	TI	Sitara 处理器：Arm9，LPDDR，DDR2，显示 \| ZCE \| 361 \| 0	获取价格
AM1806EZCE4	TI	Sitara 处理器：Arm9，LPDDR，DDR2，显示 \| ZCE \| 361 \| 0	获取价格
AM1806EZCEA3	TI	Sitara 处理器：Arm9，LPDDR，DDR2，显示 \| ZCE \| 361 \| -	获取价格