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AIM1714BB6MC7D5T08 PDF预览

AIM1714BB6MC7D5T08

更新时间: 2024-02-28 09:08:18
品牌 Logo 应用领域
VICOR LTE光电二极管
页数 文件大小 规格书
14页 732K
描述
EMI FILTER AND SINGLE PHASE AC R

AIM1714BB6MC7D5T08 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:,
Reach Compliance Code:compliant风险等级:5.54
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-PDMA-T4
长度:44.6 mm功能数量:1
端子数量:4最高工作温度:100 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:9.601 mm
最大供电电压 (Vsup):264 V最小供电电压 (Vsup):85 V
表面贴装:NO温度等级:INDUSTRIAL
端子面层:Gold/Palladium (Au/Pd) - with Nickel (Ni) barrier端子形式:THROUGH-HOLE
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:35.5 mmBase Number Matches:1

AIM1714BB6MC7D5T08 数据手册

 浏览型号AIM1714BB6MC7D5T08的Datasheet PDF文件第7页浏览型号AIM1714BB6MC7D5T08的Datasheet PDF文件第8页浏览型号AIM1714BB6MC7D5T08的Datasheet PDF文件第9页浏览型号AIM1714BB6MC7D5T08的Datasheet PDF文件第11页浏览型号AIM1714BB6MC7D5T08的Datasheet PDF文件第12页浏览型号AIM1714BB6MC7D5T08的Datasheet PDF文件第13页 
AIM1714xB6MC7D5yzz  
Thermal Considerations  
The AIM in a VIA package can be cooled using single side cooling  
from the bottom side (i.e., facing opposite the screws of PCB pins).  
Since the AIM has a maximum internal temperature rating, it is  
necessary to estimate this internal temperature based on a system-  
level thermal solution. To this purpose, it is helpful to simplify the  
thermal solution into a roughly equivalent circuit where power  
dissipation is modeled as a current source, isothermal surface  
temperatures are represented as voltages sources, and thermal  
resistances are represented as resistors. Figure 4 shows the bottom  
side cooling “thermal circuit” for the AIM in VIA package:  
Maximum internal temperature  
RJC  
+ TC_BOT  
s
PDISS  
s
Figure 4 — Bottom-side cooling VIA thermal model  
The internal power dissipation is PDISS, RJC_BOT is the thermal  
resistance characteristic of the VIA package and the bottom surface  
temperature is represented as TC_BOT. The AIM is best attached to a  
material with high thermal conductivity (e.g. aluminum or copper)  
to maintain temperature uniformity across the bottom side.  
AIM™ in a VIA Package  
Page 10 of 14  
Rev 1.2  
08/2017  

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