AFE78101, AFE88101
ZHCSP80 –DECEMBER 2022
www.ti.com.cn
9 Device and Documentation Support
9.1 Documentation Support
9.1.1 Related Documentation
For related documentation see the following:
• Texas Instruments, AFE881H1 Evaluation Module User's Guide
• Texas Instruments, REF35 Ultra Low-Power, High-Precision Voltage Reference data sheet
• Texas Instruments, OPA391 Precision, Ultra-Low IQ, Low Offset Voltage, e-trim™ Op Amp data sheet
• Texas Instruments, ADS1220 4-Channel, 2-kSPS, Low-Power, 24-Bit ADC with Integrated PGA and
Reference data sheet
• Texas Instruments, TPS7A16 60-V, 5-µA IQ, 100-mA, Low-Dropout Voltage Regulator With Enable and
Power-Good data sheet
• Texas Instruments, TPS7A02 Nanopower IQ, 25-nA, 200-mA, Low-Dropout Voltage Regulator With Fast
Transient Response data sheet
• Texas Instruments, ISO7021 Ultra-Low Power Two-Channel Digital Isolator data sheet
• Texas Instruments, Isolated, Ultra-Low Power Design for 4- to 20-mA Loop Powered Transmitters design
guide
• Texas Instruments, Isolated Loop Powered Thermocouple Transmitter design guide
• Texas Instruments, Small Form Factor, 2-Wire, 4- to 20-mA Current-Loop, RTD Temperature Transmitter
design guide
• Texas Instruments, Isolated Power and Data Interface for Low-power Applications reference design
• Texas Instruments, Uniquely Efficient Isolated DC/DC Converter for Ultra-Low Power and Low-Power
Applications design guide
9.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
9.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
9.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
9.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
9.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2023 Texas Instruments Incorporated
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