Datasheet > AFBR-2624Z

AFBR-2624Z

更新时间： 2024-01-18 18:34:14

品牌	Logo	应用领域
博通 - BOARDCOM		/
页数	文件大小	规格书
11页	464K
描述
The AFBR-2624Z receiver consists of an IC with an integrated photodiode to produce a logic compati

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AFBR-2624Z 数据手册

Interlocked (Stacked) Assemblies (refer to Figure 1)

Horizontal packages may be stacked by placing units with pins facing upward. Initially engage the inter-

locking mechanism by sliding the L bracket body from above into the L slot body of the lower package. Use

a straight edge, such as a ruler, to bring all stacked units into uniform alignment. This technique prevents

potential harm that could occur to ﬁngers and hands of assemblers from the package pins. Stacked horizontal

packages can be disengaged if necessary. Repeated stacking and unstacking causes no damage to individual units.

To stack vertical packages, hold one unit in each hand, with the pins facing away and the optical ports on the bottom.

Slide the L bracket unit into the L slot unit. The straight edge used for horizontal package alignment is not needed.

Stacking Horizontal Modules

Stacking Vertical Modules

Tilted (30°) Module

Figure 1. Interlocked (stacked) Horizontal, Vertical and Tilted (30°) packages

1 2 3 456 7 8...11

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