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ADUM241D0BRWZ-RL PDF预览

ADUM241D0BRWZ-RL

更新时间: 2024-01-26 00:47:16
品牌 Logo 应用领域
亚德诺 - ADI 光电二极管
页数 文件大小 规格书
26页 714K
描述
ADUM241D0BRWZ-RL

ADUM241D0BRWZ-RL 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active包装说明:SOP,
针数:16Reach Compliance Code:compliant
风险等级:5.56模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:R-PDSO-G16JESD-609代码:e3
长度:10.3 mm湿度敏感等级:3
功能数量:1端子数量:16
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260座面最大高度:2.65 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Tin (Sn)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:7.5 mm
Base Number Matches:1

ADUM241D0BRWZ-RL 数据手册

 浏览型号ADUM241D0BRWZ-RL的Datasheet PDF文件第19页浏览型号ADUM241D0BRWZ-RL的Datasheet PDF文件第20页浏览型号ADUM241D0BRWZ-RL的Datasheet PDF文件第21页浏览型号ADUM241D0BRWZ-RL的Datasheet PDF文件第23页浏览型号ADUM241D0BRWZ-RL的Datasheet PDF文件第24页浏览型号ADUM241D0BRWZ-RL的Datasheet PDF文件第25页 
ADuM240D/ADuM240E/ADuM241D/ADuM241E/ADuM242D/ADuM242E  
APPLICATIONS INFORMATION  
Data Sheet  
PCB LAYOUT  
JITTER MEASUREMENT  
The ADuM240D/ADuM240E/ADuM241D/ADuM241E/  
ADuM242D/ADuM242E digital isolators require no external  
interface circuitry for the logic interfaces. Power supply bypassing  
is strongly recommended at the input and output supply pins  
(see Figure 21). Bypass capacitors are most conveniently connected  
between Pin 1 and Pin 2 for VDD1 and between Pin 15 and Pin 16  
for VDD2. The recommended bypass capacitor value is between  
0.01 μF and 0.1 μF. The total lead length between both ends of  
the capacitor and the input power supply pin must not exceed  
10 mm. Bypassing between Pin 1 and Pin 8 and between Pin 9  
and Pin 16 must also be considered, unless the ground pair on  
each package side is connected close to the package.  
Figure 23 shows the eye diagram for the ADuM240D/ADuM240E/  
ADuM241D/ADuM241E/ADuM242D/ADuM242E. The  
measurement was taken using an Agilent 81110A pulse pattern  
generator at 150 Mbps with pseudorandom bit sequences (PRBS)  
2(n − 1), n = 14, for 5 V supplies. Jitter was measured with the  
Tektronix Model 5104B oscilloscope, 1 GHz, 10 GSPS with the  
DPOJET jitter and eye diagram analysis tools. The result shows a  
typical measurement on the ADuM240D/ADuM240E/  
ADuM241D/ADuM241E/ADuM242D/ADuM242E with  
490 ps p-p jitter.  
5
4
3
2
1
0
V
V
DD2  
DD1  
GND  
V
V
GND  
1
IA  
IB  
2
V
V
V
V
OA  
OB  
/V  
IC OC  
V
V
/V  
IC OC  
/V  
/V  
ID OD  
ID OD  
DISABLE /V /NIC  
DISABLE /V /NIC  
2 E2  
1
E1  
GND  
GND  
2
1
Figure 21. Recommended Printed Circuit Board Layout  
In applications involving high common-mode transients, ensure  
that board coupling across the isolation barrier is minimized.  
Furthermore, design the board layout such that any coupling  
that does occur equally affects all pins on a given component  
side. Failure to ensure this can cause voltage differentials between  
pins exceeding the Absolute Maximum Ratings of the device,  
thereby leading to latch-up or permanent damage.  
–10  
–5  
0
5
10  
TIME (ns)  
Figure 23. ADuM240D/ADuM240E/ADuM241D/ADuM241E/ADuM242D/  
ADuM242E Eye Diagram  
INSULATION LIFETIME  
See the AN-1109 Application Note for board layout guidelines.  
All insulation structures eventually break down when subjected  
to voltage stress over a sufficiently long period. The rate of  
insulation degradation is dependent on the characteristics of the  
voltage waveform applied across the insulation as well as on the  
materials and material interfaces.  
PROPAGATION DELAY RELATED PARAMETERS  
Propagation delay is a parameter that describes the time  
required for a logic signal to propagate through a component. The  
propagation delay to a Logic 0 output may differ from the  
propagation delay to a Logic 1 output.  
The two types of insulation degradation of primary interest are  
breakdown along surfaces exposed to the air and insulation  
wear out. Surface breakdown is the phenomenon of surface  
tracking, and the primary determinant of surface creepage  
requirements in system level standards. Insulation wear out is the  
phenomenon where charge injection or displacement currents  
inside the insulation material cause long-term insulation  
degradation.  
INPUT (V  
)
50%  
Ix  
tPLH  
tPHL  
OUTPUT (V  
)
50%  
Ox  
Figure 22. Propagation Delay Parameters  
Pulse width distortion is the maximum difference between these  
two propagation delay values and is an indication of how  
accurately the timing of the input signal is preserved.  
Surface Tracking  
Surface tracking is addressed in electrical safety standards by  
setting a minimum surface creepage based on the working voltage,  
the environmental conditions, and the properties of the insulation  
material. Safety agencies perform characterization testing on the  
surface insulation of components that allows the components to be  
categorized in different material groups. Lower material group  
ratings are more resistant to surface tracking and, therefore, can  
provide adequate lifetime with smaller creepage. The minimum  
creepage for a given working voltage and material group is in each  
Channel matching is the maximum amount the propagation  
delay differs between channels within a single ADuM240D/  
ADuM240E/ADuM241D/ADuM241E/ADuM242D/ADuM242E  
component.  
Propagation delay skew is the maximum amount the propagation  
delay differs between multiple ADuM240D/ADuM240E/  
ADuM241D/ADuM241E/ADuM242D/ADuM242E components  
operating under the same conditions  
Rev. D | Page 22 of 26  
 
 
 
 
 
 
 

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