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ADT75ARM-REEL7 PDF预览

ADT75ARM-REEL7

更新时间: 2024-01-31 06:52:00
品牌 Logo 应用领域
亚德诺 - ADI 传感器换能器温度传感器输出元件
页数 文件大小 规格书
24页 389K
描述
+-1∑C Accurate, 12-Bit Digital Temperature Sensor

ADT75ARM-REEL7 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ActiveReach Compliance Code:unknown
风险等级:5.76Is Samacsys:N
最大精度(摄氏度):3 Cel其他特性:ACCURACY FOR A GRADE
主体宽度:3 mm主体高度:0.85 mm
主体长度或直径:3 mm外壳:PLASTIC
安装特点:SURFACE MOUNT位数:12
最大工作电流:0.001 mA最高工作温度:125 °C
最低工作温度:-55 °C输出接口类型:I2C INTERFACE
封装形状/形式:SQUARE传感器/换能器类型:TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
最大供电电压:5.5 V最小供电电压:3 V
表面贴装:YES端子面层:NOT SPECIFIED
端接类型:SOLDERBase Number Matches:1

ADT75ARM-REEL7 数据手册

 浏览型号ADT75ARM-REEL7的Datasheet PDF文件第18页浏览型号ADT75ARM-REEL7的Datasheet PDF文件第19页浏览型号ADT75ARM-REEL7的Datasheet PDF文件第20页浏览型号ADT75ARM-REEL7的Datasheet PDF文件第21页浏览型号ADT75ARM-REEL7的Datasheet PDF文件第23页浏览型号ADT75ARM-REEL7的Datasheet PDF文件第24页 
 ꢁT75C  
C
Once the thermal impedance is determined, the temperature of  
the heat source can be inferred from the ADT75 output. As  
much as 60% of the heat transferred from the heat source to the  
thermal sensor on the ADT75 die is discharged via the copper  
tracks, the package pins, and the bond pads. Of the pins on the  
ADT75, the GND pin transfers most of the heat. Therefore, to  
measure the temperature of a heat source it is recommended  
that the thermal resistance between the ADT75 GND pin and  
the GND of the heat source is reduced as much as possible.  
TEMPERATURE MONITORING  
The ADT75 is ideal for monitoring the thermal environment  
within electronic equipment. For eꢀample, the surface-mounted  
package accurately reflects the eꢀact thermal conditions that  
affect nearby integrated circuits.  
The ADT75 measures and converts the temperature at the  
surface of its own semiconductor chip. When the ADT75 is  
used to measure the temperature of a nearby heat source, the  
thermal impedance between the heat source and the ADT75  
must be considered. Often, a thermocouple or other  
temperature sensor is used to measure the temperature of the  
source, while the temperature is monitored by reading back  
from the ADT75 temperature value register.  
For eꢀample, use the ADT75s unique properties to monitor a  
high-power dissipation microprocessor. The ADT75 device, in a  
surface-mounted package, is mounted directly beneath the  
microprocessor’s pin grid array (PGA) package. The ADT75  
produces a linear temperature output while needing only two  
I/O pins and requiring no eꢀternal characterization.  
Rev. 0 | Page 22 of 24  
 

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