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ADT6504ARJP015 PDF预览

ADT6504ARJP015

更新时间: 2024-01-13 08:23:54
品牌 Logo 应用领域
亚德诺 - ADI 开关传感器换能器
页数 文件大小 规格书
16页 259K
描述
Low Cost, 2.7 V to 5.5 V, Micropower Temperature Switches in SOT-23

ADT6504ARJP015 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TSOP5/6,.11,37Reach Compliance Code:unknown
风险等级:5.92安装特点:SURFACE MOUNT
端子数量:5最大工作电流:0.085 mA
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装等效代码:TSOP5/6,.11,37
封装形状/形式:RECTANGULAR电源:3/5 V
子类别:Other Sensors表面贴装:YES
Base Number Matches:1

ADT6504ARJP015 数据手册

 浏览型号ADT6504ARJP015的Datasheet PDF文件第8页浏览型号ADT6504ARJP015的Datasheet PDF文件第9页浏览型号ADT6504ARJP015的Datasheet PDF文件第10页浏览型号ADT6504ARJP015的Datasheet PDF文件第12页浏览型号ADT6504ARJP015的Datasheet PDF文件第13页浏览型号ADT6504ARJP015的Datasheet PDF文件第14页 
Preliminary Technical Data  
ADT6501/ADT6502/ADT6503/ADT6504  
As much as 60% of the heat transferred from the heat source to  
the thermal sensor on the ADT650x die is discharged via the  
copper tracks, package pins, and bond pads. Of the pins on the  
ADT650x, the GND pins transfer most of the heat. Therefore,  
to monitor the temperature of a heat source it is recommended  
that the thermal resistance between the ADT650x GND pins  
and the GND of the heat source is reduced as much as possible.  
TEMPERATURE MONITORING  
The ADT6501/ADT6502/ADT6503/ADT6504 are ideal for  
monitoring the thermal environment within electronic  
equipment. For example, the surface-mount package accurately  
reflects the exact thermal conditions that affect nearby  
integrated circuits.  
The ADT650x measure and convert the temperature at the  
surface of its own semiconductor chip. When the ADT650x are  
used to measure the temperature of a nearby heat source, the  
thermal impedance between the heat source and the ADT650x  
must be as low as possible.  
For example, use the unique properties of the ADT650x to  
monitor a high power dissipation microprocessor. The  
ADT650x device, in its SOT-23 package, is mounted directly  
beneath the microprocessors pin grid array (PGA) package.  
The ADT650x requires no external characterization.  
Rev. PrA | Page 11 of 16  
 

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