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ADSP-BF532WBBCZ-4A PDF预览

ADSP-BF532WBBCZ-4A

更新时间: 2024-01-12 00:09:30
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
60页 3025K
描述
Blackfin Embedded Processor

ADSP-BF532WBBCZ-4A 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:12 X 12 MM, 1.70 MM HEIGHT, ROHS COMPLIANT, MO-205AE, CSPBGA-160针数:160
Reach Compliance Code:unknownECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.83
其他特性:ALSO REQUIRES 3V OR 3.3V SUPPLY地址总线宽度:20
桶式移位器:YES位大小:32
边界扫描:YES最大时钟频率:40 MHz
外部数据总线宽度:16格式:FIXED POINT
内部总线架构:MULTIPLEJESD-30 代码:S-PBGA-B160
JESD-609代码:e1长度:12 mm
低功率模式:YES端子数量:160
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA160,14X14,32封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:1.2,2.5/3.3 V认证状态:Not Qualified
座面最大高度:1.7 mm速度:400 MHz
子类别:Microprocessors最大供电电压:1.32 V
最小供电电压:0.8 V标称供电电压:1.2 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:12 mmuPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF532WBBCZ-4A 数据手册

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ADSP-BF531/ADSP-BF532  
population count, modulo 232 multiply, divide primitives, satu-  
ration and rounding, and sign/exponent detection. The set of  
video instructions includes byte alignment and packing opera-  
tions, 16-bit and 8-bit adds with clipping, 8-bit average  
operations, and 8-bit subtract/absolute value/accumulate (SAA)  
operations. Also provided are the compare/select and vector  
search instructions.  
The Blackfin processor assembly language uses an algebraic syn-  
tax for ease of coding and readability. The architecture has been  
optimized for use in conjunction with the C/C++ compiler,  
resulting in fast and efficient software implementations.  
MEMORY ARCHITECTURE  
The ADSP-BF531/ADSP-BF532 processor views memory as a  
single unified 4G byte address space, using 32-bit addresses. All  
resources, including internal memory, external memory, and  
I/O control registers, occupy separate sections of this common  
address space. The memory portions of this address space are  
arranged in a hierarchical structure to provide a good cost/per-  
formance balance of some very fast, low latency on-chip  
memory as cache or SRAM, and larger, lower cost and perfor-  
mance off-chip memory systems. See Figure 3 on Page 7, and  
Figure 4 on Page 7.  
For certain instructions, two 16-bit ALU operations can be per-  
formed simultaneously on register pairs (a 16-bit high half and  
16-bit low half of a compute register). By also using the second  
ALU, quad 16-bit operations are possible.  
The 40-bit shifter can perform shifts and rotates and is used to  
support normalization, field extract, and field deposit  
instructions.  
The program sequencer controls the flow of instruction execu-  
tion, including instruction alignment and decoding. For  
program flow control, the sequencer supports PC relative and  
indirect conditional jumps (with static branch prediction), and  
subroutine calls. Hardware is provided to support zero-over-  
head looping. The architecture is fully interlocked, meaning that  
the programmer need not manage the pipeline when executing  
instructions with data dependencies.  
The L1 memory system is the primary highest performance  
memory available to the Blackfin processor. The off-chip mem-  
ory system, accessed through the external bus interface unit  
(EBIU), provides expansion with SDRAM, flash memory, and  
SRAM, optionally accessing up to 132M bytes of  
physical memory.  
The memory DMA controller provides high bandwidth data-  
movement capability. It can perform block transfers of code or  
data between the internal memory and the external  
memory spaces.  
The address arithmetic unit provides two addresses for simulta-  
neous dual fetches from memory. It contains a multiported  
register file consisting of four sets of 32-bit index, modify,  
length, and base registers (for circular buffering), and eight  
additional 32-bit pointer registers (for C-style indexed stack  
manipulation).  
Internal (On-Chip) Memory  
The ADSP-BF531/ADSP-BF532 processor has three blocks of  
on-chip memory providing high bandwidth access to the core.  
Blackfin processors support a modified Harvard architecture in  
combination with a hierarchical memory structure. Level 1 (L1)  
memories are those that typically operate at the full processor  
speed with little or no latency. At the L1 level, the instruction  
memory holds instructions only. The two data memories hold  
data, and a dedicated scratchpad data memory stores stack and  
local variable information.  
The first is the L1 instruction memory, consisting of up to  
48K bytes SRAM, of which 16K bytes can be configured as a  
four way set-associative cache. This memory is accessed at full  
processor speed.  
The second on-chip memory block is the L1 data memory, con-  
sisting of one bank of 32K bytes. The memory bank is  
configurable, offering both cache and SRAM functionality. This  
memory block is accessed at full processor speed.  
In addition, multiple L1 memory blocks are provided, offering a  
configurable mix of SRAM and cache. The memory manage-  
ment unit (MMU) provides memory protection for individual  
tasks that may be operating on the core and can protect system  
registers from unintended access.  
The third memory block is a 4K byte scratchpad SRAM which  
runs at the same speed as the L1 memories, but is only accessible  
as data SRAM and cannot be configured as cache memory.  
The architecture provides three modes of operation: user mode,  
supervisor mode, and emulation mode. User mode has  
restricted access to certain system resources, thus providing a  
protected software environment, while supervisor mode has  
unrestricted access to the system and core resources.  
External (Off-Chip) Memory  
The external bus interface can be used with both asynchronous  
devices such as SRAM, FLASH, EEPROM, ROM, and I/O  
devices, and synchronous devices such as SDRAMs. The bus  
width is always 16 bits. A1 is the least significant address of a  
16-bit word. 8-bit peripherals should be addressed as if they  
were 16-bit devices, where only the lower eight bits of data  
should be used.  
The Blackfin processor instruction set has been optimized so  
that 16-bit opcodes represent the most frequently used instruc-  
tions, resulting in excellent compiled code density. Complex  
DSP instructions are encoded into 32-bit opcodes, representing  
fully featured multifunction instructions. Blackfin processors  
support a limited multi-issue capability, where a 32-bit instruc-  
tion can be issued in parallel with two 16-bit instructions,  
allowing the programmer to use many of the core resources in a  
single instruction cycle.  
The PC133-compliant SDRAM controller can be programmed  
to interface to up to 128M bytes of SDRAM. The SDRAM con-  
troller allows one row to be open for each internal SDRAM  
bank, for up to four internal SDRAM banks, improving overall  
system performance.  
Rev. D  
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Page 5 of 60  
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August 2006  

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