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ADSP-21367KBPZ-X PDF预览

ADSP-21367KBPZ-X

更新时间: 2024-01-18 07:58:32
品牌 Logo 应用领域
亚德诺 - ADI 时钟外围集成电路
页数 文件大小 规格书
60页 1360K
描述
IC 32-BIT, 55.55 MHz, OTHER DSP, PBGA256, LEAD FREE, MO-192BAL-2, SBGA-256, Digital Signal Processor

ADSP-21367KBPZ-X 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:LEAD FREE, MO-192BAL-2, SBGA-256针数:256
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.72
其他特性:ALSO REQUIRES 3.3V SUPPLY地址总线宽度:24
桶式移位器:YES位大小:32
边界扫描:YES最大时钟频率:55.55 MHz
外部数据总线宽度:32格式:FLOATING POINT
内部总线架构:MULTIPLEJESD-30 代码:S-PBGA-B256
长度:27 mm低功率模式:NO
端子数量:256最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:HLBGA封装等效代码:BGA256,20X20,50
封装形状:SQUARE封装形式:GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
峰值回流温度(摄氏度):260电源:1.3,3.3 V
认证状态:Not QualifiedRAM(字数):65536
座面最大高度:1.7 mm子类别:Digital Signal Processors
最大供电电压:1.365 V最小供电电压:1.235 V
标称供电电压:1.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:27 mmuPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches:1

ADSP-21367KBPZ-X 数据手册

 浏览型号ADSP-21367KBPZ-X的Datasheet PDF文件第4页浏览型号ADSP-21367KBPZ-X的Datasheet PDF文件第5页浏览型号ADSP-21367KBPZ-X的Datasheet PDF文件第6页浏览型号ADSP-21367KBPZ-X的Datasheet PDF文件第8页浏览型号ADSP-21367KBPZ-X的Datasheet PDF文件第9页浏览型号ADSP-21367KBPZ-X的Datasheet PDF文件第10页 
ADSP-21367/ADSP-21368/ADSP-21369  
Table 4. External Memory for SDRAM Addresses  
FAMILY PERIPHERAL ARCHITECTURE  
The ADSP-21367/ADSP-21368/ADSP-21369 family contains a  
rich set of peripherals that support a wide variety of applications  
including high quality audio, medical imaging, communica-  
tions, military, test equipment, 3D graphics, speech recognition,  
motor control, imaging, and other applications.  
Size in  
Words  
Bank  
Address Range  
Bank 0  
Bank 1  
Bank 2  
Bank 3  
62M  
0x0020 0000–0x03FF FFFF  
0x0400 0000–0x07FF FFFF  
0x0800 0000–0x0BFF FFFF  
0x0C00 0000–0x0FFF FFFF  
64M  
External Port  
64M  
The external port interface supports access to the external mem-  
ory through core and DMA accesses. The external memory  
address space is divided into four banks. Any bank can be pro-  
grammed as either asynchronous or synchronous memory. The  
external ports of the ADSP-21367/8/9 processors are comprised  
of the following modules.  
• An Asynchronous Memory Interface which communicates  
with SRAM, FLASH, and other devices that meet the stan-  
dard asynchronous SRAM access protocol. The AMI  
supports 14M words of external memory in bank 0 and  
16M words of external memory in bank 1, bank 2, and  
bank 3.  
• An SDRAM controller that supports a glueless interface  
with any of the standard SDRAMs. The SDC supports 62M  
words of external memory in bank 0, and 64M words of  
external memory in bank 1, bank 2, and bank 3.  
• Arbitration Logic to coordinate core and DMA transfers  
between internal and external memory over the external  
port.  
64M  
for connection of industry-standard synchronous DRAM  
devices and DIMMs (dual inline memory module), while the  
second is an asynchronous memory controller intended to  
interface to a variety of memory devices. Four memory select  
pins enable up to four separate devices to coexist, supporting  
any desired combination of synchronous and asynchronous  
device types. Non-SDRAM external memory address space is  
shown in Table 5.  
Table 5. External Memory for Non-SDRAM Addresses  
Size in  
Words  
Bank  
Address Range  
Bank 0  
Bank 1  
Bank 2  
Bank 3  
14M  
0x0020 0000–0x00FF FFFF  
0x0400 0000–0x04FF FFFF  
0x0800 0000–0x08FF FFFF  
0x0C00 0000–0x0CFF FFFF  
16M  
16M  
• A Shared Memory Interface that allows the connection of  
up to four ADSP-21368 processors to create shared exter-  
nal bus systems (ADSP-21368 only).  
16M  
Shared External Memory  
SDRAM Controller  
The ADSP-21368 processor supports connecting to common  
shared external memory with other ADSP-21368 processors to  
create shared external bus processor systems. This support  
includes:  
• Distributed, on-chip arbitration for the shared external bus  
• Fixed and rotating priority bus arbitration  
• Bus time-out logic  
The SDRAM controller provides an interface of up to four sepa-  
rate banks of industry-standard SDRAM devices or DIMMs, at  
speeds up to fSCLK. Fully compliant with the SDRAM standard,  
each bank has its own memory select line (MS0–MS3), and can  
be configured to contain between 16M bytes and 128M bytes of  
memory. SDRAM external memory address space is shown in  
Table 4.  
A set of programmable timing parameters is available to config-  
ure the SDRAM banks to support slower memory devices. The  
memory banks can be configured as either 32 bits wide for max-  
imum performance and bandwidth or 16 bits wide for  
minimum device count and lower system cost.  
The SDRAM controller address, data, clock, and control pins  
can drive loads up to distributed 30 pF loads. For larger memory  
systems, the SDRAM controller external buffer timing should  
be selected and external buffering should be provided so that the  
load on the SDRAM controller pins does not exceed 30 pF.  
• Bus lock  
Multiple processors can share the external bus with no addi-  
tional arbitration logic. Arbitration logic is included on-chip to  
allow the connection of up to four processors.  
Bus arbitration is accomplished through the BR1–4 signals and  
the priority scheme for bus arbitration is determined by the set-  
ting of the RPBA pin. Table 8 on Page 13 provides descriptions  
of the pins used in multiprocessor systems.  
External Port Throughput  
The throughput for the external port, based on 166 MHz clock  
and 32-bit data bus, is 221M bytes/s for the AMI and 664M  
bytes/s for SDRAM.  
External Memory  
The external port provides a high performance, glueless inter-  
face to a wide variety of industry-standard memory devices. The  
32-bit wide bus can be used to interface to synchronous and/or  
asynchronous memory devices through the use of its separate  
internal memory controllers. The first is an SDRAM controller  
Rev. E  
| Page 7 of 60 | July 2009  
 
 

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