ADS131M02
SBAS853A – JANUARY 2020 – REVISED APRIL 2021
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6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
POWER SUPPLY
AVDD to AGND, normal operating modes
2.7
2.4
3.0
3.0
0
3.6
3.6
0.3
3.6
Analog power supply
AVDD to AGND, standby and current-detect modes
AGND to DGND
V
V
–0.3
2.7
DVDD to DGND
3.0
Digital power supply
DVDD to DGND, DVDD shorted to CAP (digital LDO
bypassed)
1.65
1.8
2
ANALOG INPUTS(1)
Gain = 1, 2, or 4
AGND – 1.3
AGND – 1.3
–VREF / Gain
AVDD
AVDD – 1.8
VREF / Gain
VAINxP
VAINxN
,
Absolute input voltage
V
V
Gain = 8, 16, 32, 64 or 128
VIN = VAINxP - VAINxN
VIN
Differential input voltage
EXTERNAL CLOCK SOURCE
High-resolution mode
Low-power mode
0.3
0.3
8.192
4.096
2.048
50%
8.4
4.15
2.08
60%
fCLKIN
External clock frequency
MHz
Very-low-power mode
0.3
Duty cycle
40%
DIGITAL INPUTS
Input voltage
TEMPERATURE RANGE
TA Operating ambient temperature
DGND
–40
DVDD
125
V
°C
(1) The subscript "x" signifies the channel. For example, the positive analog input to channel 0 is named AIN0P. See the Pin
Configurations and Functions section for the pin names.
6.4 Thermal Information
ADS131M02
THERMAL METRIC (1)
RUK (WQFN)
20 PINS
94.1
PW (TSSOP)
20 PINS
94.9
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
58.1
34.9
RθJB
ΨJT
ΨJB
Junction-to-board thermal resistance
64.3
46.4
Junction-to-top characterization parameter
Junction-to-board characterization parameter
31.8
2.7
58.0
46.0
RθJC(bot) Junction-to-case (bottom) thermal resistance
5.9
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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