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ADS131M02IRUKT

更新时间: 2022-06-24 15:39:41
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描述
ADS131M02 2-Channel, Simultaneously-Sampling, 24-Bit, Delta-Sigma ADC

ADS131M02IRUKT 数据手册

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ADS131M02  
SBAS853A – JANUARY 2020 – REVISED APRIL 2021  
www.ti.com  
6.3 Recommended Operating Conditions  
over operating ambient temperature range (unless otherwise noted)  
MIN  
NOM  
MAX  
UNIT  
POWER SUPPLY  
AVDD to AGND, normal operating modes  
2.7  
2.4  
3.0  
3.0  
0
3.6  
3.6  
0.3  
3.6  
Analog power supply  
AVDD to AGND, standby and current-detect modes  
AGND to DGND  
V
V
–0.3  
2.7  
DVDD to DGND  
3.0  
Digital power supply  
DVDD to DGND, DVDD shorted to CAP (digital LDO  
bypassed)  
1.65  
1.8  
2
ANALOG INPUTS(1)  
Gain = 1, 2, or 4  
AGND – 1.3  
AGND – 1.3  
–VREF / Gain  
AVDD  
AVDD – 1.8  
VREF / Gain  
VAINxP  
VAINxN  
,
Absolute input voltage  
V
V
Gain = 8, 16, 32, 64 or 128  
VIN = VAINxP - VAINxN  
VIN  
Differential input voltage  
EXTERNAL CLOCK SOURCE  
High-resolution mode  
Low-power mode  
0.3  
0.3  
8.192  
4.096  
2.048  
50%  
8.4  
4.15  
2.08  
60%  
fCLKIN  
External clock frequency  
MHz  
Very-low-power mode  
0.3  
Duty cycle  
40%  
DIGITAL INPUTS  
Input voltage  
TEMPERATURE RANGE  
TA Operating ambient temperature  
DGND  
–40  
DVDD  
125  
V
°C  
(1) The subscript "x" signifies the channel. For example, the positive analog input to channel 0 is named AIN0P. See the Pin  
Configurations and Functions section for the pin names.  
6.4 Thermal Information  
ADS131M02  
THERMAL METRIC (1)  
RUK (WQFN)  
20 PINS  
94.1  
PW (TSSOP)  
20 PINS  
94.9  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top) Junction-to-case (top) thermal resistance  
58.1  
34.9  
RθJB  
ΨJT  
ΨJB  
Junction-to-board thermal resistance  
64.3  
46.4  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
31.8  
2.7  
58.0  
46.0  
RθJC(bot) Junction-to-case (bottom) thermal resistance  
5.9  
N/A  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
Copyright © 2021 Texas Instruments Incorporated  
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