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ADP5585ACPZ-01-R7 PDF预览

ADP5585ACPZ-01-R7

更新时间: 2024-01-30 13:39:08
品牌 Logo 应用领域
亚德诺 - ADI 解码器
页数 文件大小 规格书
40页 605K
描述
Keypad Decoder and I/O Expansion

ADP5585ACPZ-01-R7 技术参数

Source Url Status Check Date:2013-05-01 14:56:47.079是否无铅: 含铅
是否Rohs认证: 符合生命周期:Active
零件包装代码:QFN包装说明:HVQCCN,
针数:16Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.55JESD-30 代码:S-XQCC-N16
JESD-609代码:e3长度:3 mm
湿度敏感等级:3功能数量:1
端子数量:16最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
座面最大高度:0.8 mm标称供电电压:1.8 V
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:3 mmBase Number Matches:1

ADP5585ACPZ-01-R7 数据手册

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ADP5585  
Data Sheet  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Functional Description.....................................................................9  
Event FIFO .....................................................................................9  
Key Scan Control...........................................................................9  
GPI Input..................................................................................... 12  
GPO Output................................................................................ 12  
Logic Blocks ................................................................................ 12  
PWM Block................................................................................. 13  
Reset Blocks ................................................................................ 14  
Register Interface............................................................................ 15  
Register Map ................................................................................... 17  
Detailed Register Descriptions................................................. 19  
Applications Diagram.................................................................... 36  
Outline Dimensions....................................................................... 37  
Ordering Guide .......................................................................... 38  
Applications....................................................................................... 1  
Functional Block Diagram .............................................................. 1  
General Description ......................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Timing Diagram ........................................................................... 4  
Absolute Maximum Ratings............................................................ 5  
Thermal Resistance ...................................................................... 5  
ESD Caution.................................................................................. 5  
Pin Configurations and Function Descriptions ........................... 6  
Theory of Operation ........................................................................ 7  
Device Enable................................................................................ 8  
Device Overview .......................................................................... 8  
REVISION HISTORY  
1/13—Rev. B to Rev. C  
10/11—Rev. Sp0 to Rev. A  
Changes to Detailed Register Description Section .................... 19  
Changes to Table 31 and Table 32 ................................................ 24  
Changes to Table 33, Table 34, and Table 35............................... 25  
Changes to Table 37........................................................................ 26  
Changes to Table 39........................................................................ 27  
Changes to Table 41 and Table 43 ................................................ 28  
Changes to Table 45........................................................................ 29  
Changes to Table 47........................................................................ 30  
Changes to Table 64........................................................................ 34  
Changes to Figure 27...................................................................... 36  
Added 16-Lead LFCSP_WQ Package..............................Universal  
Changes to Features Section ............................................................1  
Added Figure 4; Renumbered Sequentially ...................................6  
Changes to Table 4.............................................................................6  
Changes to Device Enable Section and Table 5.............................8  
Change to General Section............................................................ 11  
Changes to Logic Blocks Section.................................................. 12  
Changes to PWM Block Section .................................................. 13  
Changes to Interrupts Section ...................................................... 14  
Changes to Register Interface Section ......................................... 15  
Changes to Figure 27...................................................................... 35  
Updated Outline Dimensions....................................................... 36  
Changes to Ordering Guide.......................................................... 38  
7/12—Rev. A to Rev B  
Changes to Table 5............................................................................ 8  
Updated Outline Dimensions....................................................... 36  
Changes to Ordering Guide .......................................................... 37  
5/11—Revision Sp0: Initial Version  
Rev. C | Page 2 of 40  
 

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