Datasheet > ADP61075W3-L

ADP61075W3-L

更新时间： 2023-12-20 18:46:36

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		驱动
页数	文件大小	规格书
15页	2830K
描述
六组配置的汽车级长总线槽ACEPACK驱动模块，1200 V，1.95 mOhm，基于第三代碳化硅功率MOSFET

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ADP61075W3-L 数据手册

ADP61075W3-L

Datasheet

Automotive-grade ACEPACK DRIVE power module, sixpack topology

750 V, 1.2 mΩ typ. SiC MOSFET gen.3 based

Features

•

AQG 324 qualified

750 V blocking voltage

1.2 mΩ of typical R_DS(on)

Maximum operative junction temperature T_J= 175 °C

Very low switching energy

Low inductive compact design for an higher power density

Si₃N₄AMB substrate to improve thermal performance

SiC Power MOSFET chip sintered to substrate for improved lifetime

4.2 kV DC 1 s insulation

ACEPACK DRIVE

Directly liquid cooled base plate with pin-fins

Three integrated NTC temperature sensors

Long AC bus bar compatible with phase current sense

Application

•

Main inverter (electric traction)

Description

The ACEPACK DRIVE is a compact sixpack module optimized for hybrid and electric

vehicles traction inverter. This power module features switches based on silicon

carbide Power MOSFET 3^rdgeneration, are characterized by very low R_DS(on), very

limited switching losses and outstanding performances in synchronous rectification

working mode. This will ensure superb efficiency in final application, saving battery

recharging cycles.

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A copper base plate with pin-fin base structure make direct fluid cooling available for

this power module minimizing thermal resistance.

ADP61075W3-L

A dedicated pin-out has been developed to get the best switching performances and

press-fit pins will ensure optimal connection with driving board.

Product summary

Order code

ADP61075W3-L

ACEPACK DRIVE

Press-fit

Marking

Package

Leads type

Packing

Tray

DS13813 - Rev 2 - May 2023

For further information contact your local STMicroelectronics sales office.

www.st.com

12 3 4 5 6 7...15

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