ADP3335
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications Information .............................................................. 10
Output Capacitor Selection....................................................... 10
Input Bypass Capacitor.............................................................. 10
Noise Reduction ......................................................................... 10
Thermal Overload Protection .................................................. 10
Calculating Junction Temperature........................................... 10
Printed Circuit Board Layout Considerations........................ 11
LFCSP Layout Considerations.................................................. 11
Shutdown Mode ......................................................................... 11
Outline Dimensions....................................................................... 12
Ordering Guide .......................................................................... 13
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ........................................................................ 9
REVISION HISTORY
12/12—Rev. B to Rev. C
Changes to Figure 14 and Figure 16............................................... 7
Updated Outline Dimensions....................................................... 12
Changes to Ordering Guide .......................................................... 13
1/04—Rev. 0 to Rev. A
Format Updated..................................................................Universal
Renumbered Figures ..........................................................Universal
Removed Figure 22............................................................................6
Change to Printed Circuit Board Layout Considerations
Section.............................................................................................. 11
Added LFCSP Layout Considerations Section........................... 11
Added Package Drawing ...................................................Universal
Changes to Ordering Guide.......................................................... 16
6/10—Rev. A to Rev. B
Added Exposed Pad Notation to Figure 4 and Table 3................ 5
Added Exposed Pad Notation to Outline Dimensions ............. 12
Changes to Ordering Guide .......................................................... 13
Rev. C | Page 2 of 16
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