Datasheet > ADP3335ARM-5-REEL7

ADP3335ARM-5-REEL7

更新时间： 2024-02-27 05:27:50

品牌	Logo	应用领域
罗彻斯特 - ROCHESTER		光电二极管输出元件调节器
页数	文件大小	规格书
17页	1274K
描述
5 V FIXED POSITIVE LDO REGULATOR, 0.37 V DROPOUT, PDSO8, MO-187AA, MSOP-8

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ADP3335ARM-5-REEL7 技术参数

是否无铅：	含铅	生命周期：	Active
零件包装代码：	TSSOP	包装说明：	MSOP-8
针数：	8	Reach Compliance Code：	unknown
风险等级：	5.17	可调性：	FIXED
最大回动电压 1：	0.37 V	标称回动电压 1：	0.2 V
最大绝对输入电压：	16 V	最大输入电压：	12 V
最小输入电压：	2.6 V	JESD-30 代码：	S-PDSO-G8
长度：	3 mm	功能数量：	1
输出次数：	1	端子数量：	8
工作温度TJ-Max：	150 °C	工作温度TJ-Min：	-40 °C
最高工作温度：	85 °C	最低工作温度：	-40 °C
最大输出电流 1：	0.5 A	最大输出电压 1：	5.115 V
最小输出电压 1：	4.885 V	标称输出电压 1：	5 V
封装主体材料：	PLASTIC/EPOXY	封装代码：	TSSOP
封装等效代码：	TSSOP8,.19	封装形状：	SQUARE
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	包装方法：	TAPE AND REEL
调节器类型：	FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR	座面最大高度：	1.1 mm
表面贴装：	YES	技术：	BIPOLAR
端子形式：	GULL WING	端子节距：	0.65 mm
端子位置：	DUAL	最大电压容差：	2.3%
宽度：	3 mm	Base Number Matches：	1

ADP3335ARM-5-REEL7 数据手册

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ADP3335

2. The thermal pad of the LFCSP package provides a low

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

thermal impedance path (approximately 20°C/W) to the

PCB. Therefore, the PCB must be properly designed to

effectively conduct heat away from the package. This is

achieved by adding thermal vias to the PCB, which provide

a thermal path to the inner or bottom layers. See Figure 25

for the recommended via pattern. Note that the via

diameter is small to prevent the solder from flowing

through the via and leaving voids in the thermal pad solder

joint.

All surface-mount packages rely on the traces of the PC board

to conduct heat away from the package. Use the following

general guidelines when designing printed circuit boards to

improve both electrical and thermal performance.

1. Keep the output capacitor as close as possible to the output

and ground pins.

2. Keep the input capacitor as close as possible to the input

and ground pins.

Also, note that the thermal pad is attached to the die

substrate, so the thermal planes to which the thermal vias

connect must be electrically isolated or tied to V_IN. Do

NOT connect the thermal pad to ground.

3. PC board traces with larger cross sectional areas will

remove more heat from the ADP3335. For optimum heat

transfer, specify thick copper and use wide traces.

3. The solder mask opening should be about 120 µ (4.7 mils)

larger than the pad size, resulting in a minimum 60 µm

(2.4 mils) clearance between the pad and the solder mask.

4. It is not recommended to use solder mask or silkscreen on

the PCB traces adjacent to the ADP3335’s pins, since doing

so will increase the junction-to-ambient thermal resistance

of the package.

4. The paste mask opening is typically designed to match the

pad size used on the peripheral pads of the LFCSP package.

This should provide a reliable solder joint as long as the

stencil thickness is about 0.125 mm. The paste mask for the

thermal pad needs to be designed for the maximum

5. Use additional copper layers or planes to reduce the

thermal resistance. When connecting to other layers, use

multiple vias, if possible.

coverage to effectively remove the heat from the package.

However, due to the presence of thermal vias and the size

of the thermal pad, eliminating voids may not be possible.

LFCSP LAYOUT CONSIDERATIONS

The LFCSP package has an exposed die paddle on the bottom,

which efficiently conducts heat to the PCB. In order to achieve

the optimum performance from the LFCSP package, special

consideration must be given to the layout of the PCB. Use the

following layout guidelines for the LFCSP package.

5. The recommended paste mask stencil thickness is

0.125 mm. A laser cut stainless steel stencil with

trapezoidal walls should be used. A “No Clean” Type 3

solder paste should be used for mounting the LFCSP

package. Also, a nitrogen purge during the reflow process is

recommended.

2× VIAS, 0.250∅

35µm PLATING

0.73

0.30

6. The package manufacturer recommends that the reflow

temperature should not exceed 220°C and the time above

liquidus is less than 75 seconds. The preheat ramp should

be 3°C/second or lower. The actual temperature profile

depends on the board density and must be determined by

the assembly house as to what works best.

1.80

0.90

2.36

0.50

1.40

1.90

SHUTDOWN MODE

3.36

Applying a TTL high signal to the shutdown ( ) pin or tying it

Figure 25. 3 mm × 3 mm LFCSP Pad Pattern

(Dimensions shown in millimeters)

to the input pin, turns the output ON. Pulling

down to 0.4 V

or below, or tying it to ground, turns the output OFF. In shut-

down mode, quiescent current is reduced to a typical value of

10 nA.

1. The pad pattern is given in Figure 25. The pad dimension

should be followed closely for reliable solder joints, while

maintaining reasonable clearances to prevent solder

bridging.

Rev. A | Page 11 of 16

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ADP3335ARMZ-2.5-RL7	ADI	2.5V FIXED POSITIVE LDO REGULATOR, 0.37V DROPOUT, PDSO8, ROHS COMPLIANT, MO-187AA, MSOP-8	获取价格
ADP3335ARMZ-2.5-RL7	ROCHESTER	2.5 V FIXED POSITIVE LDO REGULATOR, 0.37 V DROPOUT, PDSO8, ROHS COMPLIANT, MO-187AA, MSOP-	获取价格

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