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ADP3120JRZ PDF预览

ADP3120JRZ

更新时间: 2024-02-07 06:36:44
品牌 Logo 应用领域
亚德诺 - ADI 驱动器MOSFET驱动器驱动程序和接口接口集成电路光电二极管
页数 文件大小 规格书
16页 275K
描述
Dual Bootstrapped 12 V MOSFET Driver with Output Disable

ADP3120JRZ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:LEAD FREE, MS-012AA, SOIC-8针数:8
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.72
Is Samacsys:N高边驱动器:YES
接口集成电路类型:HALF BRIDGE BASED MOSFET DRIVERJESD-30 代码:R-PDSO-G8
JESD-609代码:e3长度:4.9 mm
功能数量:2端子数量:8
最高工作温度:85 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
电源:12 V认证状态:Not Qualified
座面最大高度:1.75 mm子类别:MOSFET Drivers
最大供电电压:13.2 V最小供电电压:4.15 V
标称供电电压:12 V表面贴装:YES
温度等级:OTHER端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
断开时间:0.045 µs接通时间:0.07 µs
宽度:3.9 mmBase Number Matches:1

ADP3120JRZ 数据手册

 浏览型号ADP3120JRZ的Datasheet PDF文件第6页浏览型号ADP3120JRZ的Datasheet PDF文件第7页浏览型号ADP3120JRZ的Datasheet PDF文件第8页浏览型号ADP3120JRZ的Datasheet PDF文件第10页浏览型号ADP3120JRZ的Datasheet PDF文件第11页浏览型号ADP3120JRZ的Datasheet PDF文件第12页 
ADP3120  
THEORY OF OPERATION  
The ADP3120 is optimized for driving two N-channel  
MOSFETs in a synchronous buck converter topology. A single  
PWM input signal is all that is required to properly drive the  
high-side and the low-side MOSFETs. Each driver is capable of  
driving a 3 nF load at speeds up to 500 kHz.  
OVERLAP PROTECTION CIRCUIT  
The overlap protection circuit prevents both of the main power  
switches, Q1 and Q2, from being on at the same time. This is  
done to prevent shoot-through currents from flowing through  
both power switches and the associated losses that can occur  
during their on/off transitions. The overlap protection circuit  
accomplishes this by adaptively controlling the delay from the  
Q1 turn off to the Q2 turn on, and by internally setting the  
delay from the Q2 turn off to the Q1 turn on.  
A more detailed description of the ADP3120 and its features  
follows. See Figure 1.  
LOW-SIDE DRIVER  
The low-side driver is designed to drive a ground-referenced  
N-channel MOSFET. The bias to the low-side driver is  
internally connected to the VCC supply and PGND.  
To prevent the overlap of the gate drives during the Q1 turn off  
and the Q2 turn on, the overlap circuit monitors the voltage at  
the SW pin. When the PWM input signal goes low, Q1 begins  
to turn off (after propagation delay). Before Q2 can turn on, the  
overlap protection circuit makes sure that SW has first gone  
high and then waits for the voltage at the SW pin to fall from  
When the driver is enabled, the drivers output is 180° out of  
phase with the PWM input. When the ADP3120 is disabled,  
the low-side gate is held low.  
VIN to 1 V. Once the voltage on the SW pin falls to 1 V, Q2  
begins turn on. If the SW pin has not gone high first, the Q2  
turn on is delayed by a fixed 150 ns. By waiting for the voltage  
on the SW pin to reach 1 V or for the fixed delay time, the  
overlap protection circuit ensures that Q1 is off before Q2 turns  
on, regardless of variations in temperature, supply voltage, input  
pulse width, gate charge, and drive current. If SW does not go  
below 1 V after 190 ns, DRVL turns on. This can occur if the  
current flowing in the output inductor is negative and is flowing  
through the high-side MOSFET body diode.  
HIGH-SIDE DRIVER  
The high-side driver is designed to drive a floating N-channel  
MOSFET. The bias voltage for the high-side driver is developed  
by an external bootstrap supply circuit, which is connected  
between the BST and SW pins.  
The bootstrap circuit comprises a diode, D1, and bootstrap  
capacitor, CBST1. CBST2 and RBST are included to reduce the high-  
side gate drive voltage and to limit the switch node slew rate  
(called a Boot-Snap circuit—see the Application Information  
section for more details). When the ADP3120 starts up, the SW  
pin is at ground, so the bootstrap capacitor charges up to VCC  
through D1. When the PWM input goes high, the high-side  
driver begins to turn on the high-side MOSFET, Q1, by pulling  
charge out of CBST1 and CBST2. As Q1 turns on, the SW pin rises  
up to VIN, forcing the BST pin to VIN + VC(BST), which is enough  
gate-to-source voltage to hold Q1 on. To complete the cycle, Q1  
is switched off by pulling the gate down to the voltage at the SW  
pin. When the low-side MOSFET, Q2, turns on, the SW pin is  
pulled to ground. This allows the bootstrap capacitor to charge  
up to VCC again.  
The output of the high-side driver is in phase with the PWM  
input. When the driver is disabled, the high-side gate is held low.  
Rev. 0 | Page 9 of 16  
 

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