ADP160/ADP161
ABSOLUTE MAXIMUM RATINGS
Table 3.
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on the
application and board layout. In applications where high maximum
power dissipation exists, close attention to thermal board design
is required. The value of θJA may vary, depending on PCB material,
layout, and environmental conditions. The specified values of
θJA are based on a 4-layer, 4 inches × ꢀ inches, circuit board. Refer
to JESD 51-7 and JESD 51-9 for detailed information on the
board construction. For additional information, see Application
Note AN-617, MicroCSP™ Wafer Level Chip Scale Package.
Parameter
Rating
VIN to GND
VOUT to GND
−0.3 V to +6.5 V
−0.3 V to VIN
EN to GND
−0.3 V to VIN
Storage Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Soldering Conditions
−65°C to +150°C
−40°C to +125°C
−40°C to +125°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Ψ
JB is the junction to board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board. The JESD51-12, Guidelines for
Reporting and Using Electronic Package Thermal Information,
states that thermal characterization parameters are not the same
as thermal resistances. ΨJB measures the component power flowing
through multiple thermal paths rather than a single path as in
thermal resistance, θJB. Therefore, ΨJB thermal paths include
convection from the top of the package as well as radiation from
the package, factors that make ΨJB more useful in real-world
applications. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD)
using the formula
THERMAL DATA
Absolute maximum ratings only apply individually; they do not
apply in combination. The ADP160/ADP161 can be damaged
when the junction temperature limits are exceeded. Monitoring
ambient temperature does not guarantee that TJ is within the
specified temperature limits. In applications with high power
dissipation and poor thermal resistance, the maximum ambient
temperature may have to be derated.
TJ = TB + (PD × ΨJB)
Refer to JESD51-8 and JESD51-12 for more detailed information
about ΨJB.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ) of
the device is dependent on the ambient temperature (TA), the
power dissipation of the device (PD), and the junction to ambient
thermal resistance of the package (θJA).
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
ΨJB
43
58
Unit
°C/W
°C/W
Maximum junction temperature (TJ) is calculated from the ambient
temperature (TA) and power dissipation (PD) using the formula
5-Lead TSOT
4-Ball, 0.4 mm Pitch WLCSP
170
260
TJ = TA + (PD × θJA)
ESD CAUTION
Rev. 0 | Page 5 of 20
5秒后页面跳转
一文带你解读74HC244资料手册：特性、应用场景、封装方式、引脚配置说明、电气参数、推荐替代型号
AD623资料手册解读：特性、应用、封装、引脚功能及电气参数
RT9193资料手册解读：RT9193引脚功能、电气参数、替换型号推荐
VIPER22A的资料手册解读、引脚参数说明、代换型号推荐
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
