ADP160/ADP161
140
120
100
80
140
120
100
80
MAXIMUM JUNCTION TEMPERATURE
MAXIMUM JUNCTION TEMPERATURE
60
60
40
40
20
20
I
I
I
= 1mA
= 10mA
= 50mA
I
I
I
= 100mA
= 150mA
= 200mA
I
I
I
= 1mA
= 10mA
= 50mA
I
I
I
= 100mA
= 150mA
= 200mA
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
0
0.3
0
0.3
0.8
1.3
1.8
2.3
– V
2.8
(V)
3.3
3.8
4.3
4.8
0.8
1.3
1.8
2.3
– V
2.8
(V)
3.3
3.8
4.3
4.8
V
V
IN
OUT
IN
OUT
Figure 44. 100 mm2 of PCB Copper, TSOT, TA = 50°C
Figure 46. TSOT, TA = 85°C
140
120
100
80
PCB LAYOUT CONSIDERATIONS
MAXIMUM JUNCTION TEMPERATURE
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP160/ADP161.
However, as listed in Table 8, a point of diminishing returns is
reached eventually, beyond which an increase in the copper size
does not yield significant heat dissipation benefits.
60
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0402 or 060ꢀ size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
40
20
I
I
I
= 1mA
= 10mA
= 50mA
I
I
I
= 100mA
= 150mA
= 200mA
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
0
0.3
0.8
1.3
1.8
2.3
– V
2.8
(V)
3.3
3.8
4.3
4.8
V
IN
OUT
Figure 45. WLCSP, TA = 85°C
Rev. 0 | Page 17 of 20