Datasheet > 电源电路 > 线性稳压器IC> ADP160ACBZ-4.2-R7

ADP160ACBZ-4.2-R7

更新时间： 2024-01-29 04:45:17

品牌	Logo	应用领域
亚德诺 - ADI		线性稳压器IC 调节器电源电路输出元件 PC
页数	文件大小	规格书
20页	500K
描述
Ultralow Quiescent Current, 150 mA, CMOS Linear Regulator

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

ADP160ACBZ-4.2-R7 技术参数

是否无铅：	含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	BGA
包装说明：	VFBGA, BGA4,2X2,20	针数：	4
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.16
Samacsys Confidence：		Samacsys Status：	Released
Samacsys PartID：	579223	Samacsys Pin Count：	4
Samacsys Part Category：	Integrated Circuit	Samacsys Package Category：	Other
Samacsys Footprint Name：	BGA4C50P2X2_100X100X64	Samacsys Released Date：	2017-01-11 11:21:59
Is Samacsys：	N	可调性：	FIXED
最大回动电压 1：	0.195 V	标称回动电压 1：	0.105 V
最大绝对输入电压：	6.5 V	最大输入电压：	5.5 V
最小输入电压：	2.2 V	JESD-30 代码：	S-PBGA-B4
JESD-609代码：	e3	长度：	0.965 mm
最大负载调整率：	0.063%	湿度敏感等级：	1
功能数量：	1	输出次数：	1
端子数量：	4	工作温度TJ-Max：	125 °C
工作温度TJ-Min：	-40 °C	最高工作温度：	125 °C
最低工作温度：	-40 °C	最大输出电流 1：	0.15 A
最大输出电压 1：	4.347 V	最小输出电压 1：	4.053 V
标称输出电压 1：	4.2 V	封装主体材料：	PLASTIC/EPOXY
封装代码：	VFBGA	封装等效代码：	BGA4,2X2,20
封装形状：	SQUARE	封装形式：	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
包装方法：	TAPE AND REEL	峰值回流温度（摄氏度）：	260
认证状态：	Not Qualified	调节器类型：	FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度：	0.64 mm	子类别：	Other Regulators
表面贴装：	YES	技术：	CMOS
端子面层：	Matte Tin (Sn)	端子形式：	BALL
端子节距：	0.5 mm	端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	30	最大电压容差：	3.5%
宽度：	0.965 mm	Base Number Matches：	1

ADP160ACBZ-4.2-R7 数据手册

浏览型号ADP160ACBZ-4.2-R7的Datasheet PDF文件第12页

浏览型号ADP160ACBZ-4.2-R7的Datasheet PDF文件第13页

浏览型号ADP160ACBZ-4.2-R7的Datasheet PDF文件第14页

浏览型号ADP160ACBZ-4.2-R7的Datasheet PDF文件第16页

浏览型号ADP160ACBZ-4.2-R7的Datasheet PDF文件第17页

浏览型号ADP160ACBZ-4.2-R7的Datasheet PDF文件第18页

ADP160/ADP161

Consider the case where a hard short from OUT to ground occurs.

At first, the ADP160/ADP161 current limits so that only ꢀ20 mA is

conducted into the short. If self-heating of the junction is great

enough to cause its temperature to rise above 150°C, thermal

shutdown activates, turning off the output and reducing the

output current to zero. As the junction temperature cools and

drops below 1ꢀ5°C, the output turns on and conducts ꢀ20 mA

into the short, again causing the junction temperature to rise

above 150°C. This thermal oscillation between 1ꢀ5°C and

150°C causes a current oscillation between ꢀ20 mA and 0 mA

that continues as long as the short remains at the output.

Table 9. Typical Ψ_JBValues

Ψ_JB(°C/W)

TSOT

WLCSP

42.8

58.4

The junction temperature of the ADP160/ADP161 can be

calculated from the following equation:

T_J= T_A+ (P_D× θ_JA)

(2)

(ꢀ)

where:

T_Ais the ambient temperature.

P_Dis the power dissipation in the die, given by

Current and thermal limit protections are intended to protect

the device against accidental overload conditions. For reliable

operation, device power dissipation must be externally limited

so junction temperatures do not exceed 125°C.

P_D= [(V_IN− V_OUT) × I_LOAD] + (V_IN× I_GND

)

where:

_LOADis the load current.

_GNDis the ground current.

THERMAL CONSIDERATIONS

_INand V_OUTare input and output voltages, respectively.

In most applications, the ADP160/ADP161 do not dissipate

much heat due to their high efficiency. However, in applications

with high ambient temperature and high supply voltage to output

voltage differential, the heat dissipated in the package is large

enough that it can cause the junction temperature of the die to

exceed the maximum junction temperature of 125°C.

Power dissipation due to ground current is quite small and can be

ignored. Therefore, the junction temperature equation simplifies to

the following:

T_J= T_A+ {[(V_IN− V_OUT) × I_LOAD] × θ_JA}

(4)

As shown in Equation 4, for a given ambient temperature, input-

to-output voltage differential, and continuous load current, there

exists a minimum copper size requirement for the PCB to ensure

the junction temperature does not rise above 125°C. Figure ꢀ7 to

Figure 44 show the junction temperature calculations for the

different ambient temperatures, load currents, V_IN-to-V_OUT

differentials, and areas of PCB copper.

When the junction temperature exceeds 150°C, the converter enters

thermal shutdown. It recovers only after the junction temperature

has decreased below 1ꢀ5°C to prevent any permanent damage.

Therefore, thermal analysis for the chosen application is very

important to guarantee reliable performance over all conditions.

The junction temperature of the die is the sum of the ambient

temperature of the environment and the temperature rise of the

package due to the power dissipation, as shown in Equation 2.

In the case where the board temperature is known, use the

thermal characterization parameter, Ψ_JB, to estimate the junction

temperature rise (see Figure 45 and Figure 46). Maximum junction

temperature (T_J) is calculated from the board temperature (T_B)

and power dissipation (P_D) using the following formula:

To guarantee reliable operation, the junction temperature of the

ADP160/ADP161 must not exceed 125°C. To ensure the junction

temperature stays below this maximum value, the user needs to

be aware of the parameters that contribute to junction temperature

changes. These parameters include ambient temperature, power

dissipation in the power device, and thermal resistances between

the junction and ambient air (θ_JA). The θ_JAnumber is dependent

on the package assembly compounds that are used and the amount

of copper used to solder the package GND pins to the PCB.

Table 8 shows the typical θ_JAvalues of the 5-lead TSOT and the

4-ball WLCSP for various PCB copper sizes. Table 9 shows the

typical Ψ_JBvalue of the 5-lead TSOT and 4-ball WLCSP.

T_J= T_B+ (P_D× Ψ_JB)

(5)

The typical value of Ψ_JBis 58°C/W for the 4-ball WLCSP package

and 4ꢀ°C/W for the 5-lead TSOT package.

140

MAXIMUM JUNCTION TEMPERATURE

120

100

Table 8. Typical θ_JAValues

θ_JA(°C/W)

Copper Size (mm²)

TSOT

170

152

146

134

131

WLCSP

260

159

157

153

0¹

= 1mA

= 10mA

= 50mA

= 100mA

= 150mA

= 200mA

LOAD

100

300

500

0.3

0.8

1.3

1.8

2.3

– V

2.8

(V)

3.3

3.8

4.3

4.8

OUT

151

Figure 37. 500 mm²of PCB Copper, WLCSP, T_A= 25°C

¹Device soldered to minimum size pin traces.

Rev. 0 | Page 15 of 20

1...12 13 141516 17 18...20

中文翻译

下载PDF

与ADP160ACBZ-4.2-R7相关器件

型号	品牌	描述	获取价格	数据表
ADP160AUJZ-1.2-R7	ADI	Ultralow Quiescent Current, 150 mA, CMOS Linear Regulator	获取价格
ADP160AUJZ-1.5-R7	ADI	Ultralow Quiescent Current, 150 mA, CMOS Linear Regulator	获取价格
ADP160AUJZ-1.8-R7	ADI	Ultralow Quiescent Current, 150 mA, CMOS Linear Regulator	获取价格
ADP160AUJZ-2.3-R7	ADI	Ultralow Quiescent Current, 150 mA, CMOS Linear Regulators	获取价格
ADP160AUJZ-2.5-R7	ADI	Ultralow Quiescent Current, 150 mA, CMOS Linear Regulator	获取价格
ADP160AUJZ-2.7-R7	ADI	Ultralow Quiescent Current, 150 mA, CMOS Linear Regulators	获取价格

与ADP160ACBZ-4.2-R7相关文章

深入解析CS8416引脚说明、参数、技术特点
2024-06-03

1
TPA3116D2功放芯片参数详解、引脚说明
2024-06-03

5
移位寄存器74HC165引脚说明、驱动程序示例解读
2024-06-03

5
深入解析AD9833：DDS频率合成器的卓越性能与广泛应用
2024-06-03

2

产品中心

服务支持

精选活动

关于我们

帮助中心

ADP160ACBZ-4.2-R7

ADP160ACBZ-4.2-R7 技术参数

ADP160ACBZ-4.2-R7 数据手册

与ADP160ACBZ-4.2-R7相关器件

与ADP160ACBZ-4.2-R7相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

ADP160ACBZ-4.2-R7

ADP160ACBZ-4.2-R7 技术参数

ADP160ACBZ-4.2-R7 数据手册

与ADP160ACBZ-4.2-R7相关器件

与ADP160ACBZ-4.2-R7相关文章

您还可以找

您在本页遇到什么问题？