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ADN2818ACPZ-RL PDF预览

ADN2818ACPZ-RL

更新时间: 2024-01-17 00:48:10
品牌 Logo 应用领域
亚德诺 - ADI ATM集成电路SONET集成电路SDH集成电路电信集成电路电信电路异步传输模式时钟
页数 文件大小 规格书
40页 813K
描述
Continuous Rate 10 Mbps to 2.7 Gbps Clock and Data Recovery ICs

ADN2818ACPZ-RL 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC32,.2SQ,20针数:32
Reach Compliance Code:compliantECCN代码:5A991.B.3
HTS代码:8542.39.00.01风险等级:5.25
Is Samacsys:N应用程序:SONET;SDH
JESD-30 代码:S-XQCC-N32JESD-609代码:e3
长度:5 mm湿度敏感等级:3
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC32,.2SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
座面最大高度:1 mm子类别:ATM/SONET/SDH ICs
最大压摆率:0.217 mA标称供电电压:3.3 V
表面贴装:YES电信集成电路类型:ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:40
宽度:5 mmBase Number Matches:1

ADN2818ACPZ-RL 数据手册

 浏览型号ADN2818ACPZ-RL的Datasheet PDF文件第7页浏览型号ADN2818ACPZ-RL的Datasheet PDF文件第8页浏览型号ADN2818ACPZ-RL的Datasheet PDF文件第9页浏览型号ADN2818ACPZ-RL的Datasheet PDF文件第11页浏览型号ADN2818ACPZ-RL的Datasheet PDF文件第12页浏览型号ADN2818ACPZ-RL的Datasheet PDF文件第13页 
ADN2817/ADN2818  
Data Sheet  
ABSOLUTE MAXIMUM RATINGS  
THERMAL CHARACTERISTICS  
TA = TMIN to TMAX, VCC = VMIN to VMAX, VEE = 0 V,  
Thermal Resistance  
CF = 0.47 µF, SLICEP = SLICEN = VEE, unless otherwise noted.  
θJA is specified for the worst-case conditions, that is, a device  
soldered in a circuit board for surface-mount packages, on a  
4-layer board with the exposed paddle soldered to VEE.  
Table 5.  
Parameter  
Supply Voltage (VCC)  
Input Voltage (All Inputs)  
Minimum  
Maximum  
Junction Temperature, Maximum  
Storage Temperature Range  
Rating  
4.2 V  
Table 6. Thermal Resistance  
VEE − 0.4 V  
VCC + 0.4 V  
125°C  
Package Type  
θJA  
Unit  
32-Lead LFCSP  
28  
°C/W  
−65°C to +150°C  
ESD CAUTION  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Rev. E | Page 10 of 40  
 
 
 

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