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ADN2817ACP-RL

更新时间: 2024-02-01 07:58:44
品牌 Logo 应用领域
亚德诺 - ADI 时钟
页数 文件大小 规格书
35页 318K
描述
IC CLOCK RECOVERY CIRCUIT, QCC32, 5 X 5 MM, MO-220-VHHD-2, LFCSP-32, ATM/SONET/SDH IC

ADN2817ACP-RL 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC32,.2SQ,20针数:32
Reach Compliance Code:compliantECCN代码:5A991.B.3
HTS代码:8542.39.00.01风险等级:5.29
Is Samacsys:N应用程序:SONET;SDH
JESD-30 代码:S-XQCC-N32JESD-609代码:e3
长度:5 mm湿度敏感等级:3
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC32,.2SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
座面最大高度:1 mm子类别:ATM/SONET/SDH ICs
最大压摆率:0.247 mA标称供电电压:3.3 V
表面贴装:YES电信集成电路类型:ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:5 mmBase Number Matches:1

ADN2817ACP-RL 数据手册

 浏览型号ADN2817ACP-RL的Datasheet PDF文件第6页浏览型号ADN2817ACP-RL的Datasheet PDF文件第7页浏览型号ADN2817ACP-RL的Datasheet PDF文件第8页浏览型号ADN2817ACP-RL的Datasheet PDF文件第10页浏览型号ADN2817ACP-RL的Datasheet PDF文件第11页浏览型号ADN2817ACP-RL的Datasheet PDF文件第12页 
Preliminary Technical Data  
ADN2817/ADN2818  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
24  
23  
22  
21  
20  
19  
18  
17  
1
2
3
4
5
6
7
8
VCC  
VEE  
LOS  
SDA  
SCK  
SADDR5  
VCC  
VEE  
AUTOM ODE  
VCC  
VREF  
NIN  
PIN  
SL I CEP  
SL I CEN  
VEE  
ADN2817  
Figure 4. Pin Configuration  
Table 5. Pin Function Descriptions  
Pin No.  
Mnemonic  
AUTOMODE  
VCC  
Type1  
DI  
P
Description  
1
Set to Logic Low to enable analog voltage output mode for BER monitor  
Power for Limamp, LOS.  
2
3
VREF  
AO  
AI  
Internal VREF Voltage. Decouple to GND with a 0.1 μF capacitor.  
Differential Data Input. CML.  
4
NIN  
5
PIN  
AI  
Differential Data Input. CML.  
6
SLICEP  
SLICEN  
VEE  
AI  
Differential Slice Level Adjust Input.  
Differential Slice Level Adjust Input.  
GND for Limamp, LOS.  
7
AI  
8
P
9
THRADJ  
REFCLKP  
REFCLKN  
VCC  
AI  
LOS Threshold Setting Resistor.  
Differential REFCLK Input. 12.3 MHz to 200 MHz.  
Differential REFCLK Input. 12.3 MHz to 200 MHz.  
VCO Power.  
10  
DI  
DI  
P
11  
12  
13  
VEE  
P
VCO GND.  
14  
CF2  
AO  
AO  
DO  
P
Frequency Loop Capacitor.  
15  
CF1  
Frequency Loop Capacitor.  
16  
LOL  
Loss of Lock Indicator. LVTTL active high.  
FLL Detector GND.  
17  
VEE  
18  
VCC  
P
FLL Detector Power.  
19  
SADDR5  
SCK  
DI  
DI  
DI  
DO  
P
Slave Address Bit 5.  
20  
I2C Clock Input.  
21  
SDA  
I2C Data Input.  
22  
LOS  
Loss of Signal Detect Output. Active high. LVTTL.  
Output Buffer, I2C GND.  
Output Buffer, I2C Power.  
23  
VEE  
24  
VCC  
P
25  
CLKOUTN  
CLKOUTP  
SQUELCH  
DATAOUTN  
DATAOUTP  
VEE  
DO  
DO  
DI  
DO  
DO  
P
Differential Recovered Clock Output. CML.  
Differential Recovered Clock Output. CML.  
Disable Clock and Data Outputs. Active high. LVTLL.  
Differential Recovered Data Output. CML.  
Differential Recovered Data Output. CML.  
Phase Detector, Phase Shifter GND.  
Phase Detector, Phase Shifter Power.  
Relative BER monitor output. Referred to GND, Analog Voltage Output.  
Connect to GND  
26  
27  
28  
29  
30  
31  
VCC  
P
32  
VBER  
AO  
P
Exposed Pad  
Pad  
1Type: P = power, AI = analog input, AO = analog output, DI = digital input, DO = digital output.  
Rev.Pr A | Page 9 of 35  

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