ADM660/ADM8660
5.10
5.00
4.90
16
9
8
4.50
4.40
4.30
6.40
BSC
1
PIN 1
1.20
MAX
0.15
0.05
0.20
0.09
0.75
0.60
0.45
8°
0°
0.30
0.19
0.65
BSC
SEATING
PLANE
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 12. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADM660ANZ
ADM660ARZ
ADM660ARZ-REEL
ADM660ARUZ
ADM660ARUZ-REEL
ADM660ARUZ-REEL7
ADM8660ANZ
ADM8660ARZ
ADM8660ARZ-REEL
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
8-Lead Plastic Dual In-Line Package [PDIP]
N-8
R-8
R-8
RU-16
RU-16
RU-16
N-8
R-8
R-8
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
8-Lead Plastic Dual In-Line Package [PDIP]
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Standard Small Outline Package [SOIC_N]
1 Z = RoHS Compliant Part
REVISION HISTORY
4/11—Rev. B to Rev. C
Changes to Ordering Guide .......................................................... 11
12/02—Rev. A to Rev. B
Renumbered TPCs and Figures........................................Universal
Edits to Specifications ...................................................................... 2
Updated Absolute Maximum Ratings ........................................... 3
Updated Outline Dimensions....................................................... 10
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00082-0-4/11(C)
REV. C
–11–