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ADL5541 PDF预览

ADL5541

更新时间: 2024-02-24 02:10:48
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
12页 285K
描述
50 MHz to 6 GHz RF/IF Gain Block

ADL5541 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:ObsoleteReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.33.00.01
风险等级:5.7Is Samacsys:N
特性阻抗:50 Ω构造:COMPONENT
增益:14.3 dB最大输入功率 (CW):10 dBm
JESD-609代码:e3最大工作频率:6000 MHz
最小工作频率:50 MHz最高工作温度:85 °C
最低工作温度:-40 °C射频/微波设备类型:WIDE BAND MEDIUM POWER
端子面层:Matte Tin (Sn)Base Number Matches:1

ADL5541 数据手册

 浏览型号ADL5541的Datasheet PDF文件第6页浏览型号ADL5541的Datasheet PDF文件第7页浏览型号ADL5541的Datasheet PDF文件第8页浏览型号ADL5541的Datasheet PDF文件第9页浏览型号ADL5541的Datasheet PDF文件第11页浏览型号ADL5541的Datasheet PDF文件第12页 
ADL5541  
BASIC CONNECTIONS  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
The basic connections for operating the ADL5541 are shown in  
Figure 13. Recommended components are listed in Table 5. The  
input and output should be ac-coupled with appropriately sized  
capacitors (device characterization was performed with 33 pF  
capacitors). A 5 V dc bias is supplied to the amplifier via GND  
(Pin 6) and through a biasing inductor connected to RFOUT  
(Pin 8). The bias voltage should be decoupled using a 1 μF  
capacitor, a 1.2 nF capacitor, and two 68 pF capacitors.  
VCC  
C6  
1µF  
C5  
1.2nF  
C4  
68pF  
L1  
47nH  
ADL5541  
C1  
33pF  
C2  
33pF  
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
RFIN  
1 RFIN RFOUT 8  
RFOUT  
FREQUENCY (MHz)  
2 GND  
3 GND  
4 CB  
GND 7  
GND 6  
GND  
Figure 15. Noise Figure vs. Frequency from 50 MHz to 500 MHz  
VPOS 5  
VCC  
SOLDERING INFORMATION AND RECOMMENDED  
PCB LAND PATTERN  
C3  
1µF  
C7  
68pF  
Figure 16 shows the recommended land pattern for the ADL5541.  
To minimize thermal impedance, the exposed paddle on the  
package underside should be soldered down to a ground plane  
along with Pin 2, Pin 3, Pin 6, and Pin 7. If multiple ground  
layers exist, they should be stitched together using vias (a  
minimum of five vias is recommended). For more information  
on land pattern design and layout, refer to Application Note  
AN-772, A Design and Manufacturing Guide for the Lead Frame  
Chip Scale Package (LFCSP).  
Figure 13. Basic Connections  
For operation between 50 MHz and 500 MHz, a larger biasing  
choke and ac coupling capacitors are necessary (see Table 5).  
Figure 14 shows a plot of the input return loss, the output  
return loss and the gain with these components. At 100 MHz,  
the ADL5541 achieves an OIP3 of 38 dBm (POUT = 0 dBm per  
tone). The noise figure performance for operation from 50  
MHz to 500 MHz is shown in Figure 15. When operating below  
50 MHz, the ADL5541 exhibits gain peaking, and the input and  
output match degrade significantly.  
2.03mm  
PIN 1  
PIN 8  
17.0  
16.5  
16.0  
15.5  
15.0  
14.5  
14.0  
13.5  
13.0  
12.5  
12.0  
–5  
–10  
–15  
–20  
–25  
–30  
0.5mm  
1.85mm  
1.78mm  
S21  
PIN 4  
PIN 5  
1.53mm  
S22  
0.71mm  
Figure 16. Recommended Land Pattern  
S11  
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
FREQUENCY (MHz)  
Figure 14. Input Return Loss (S11), Output Return Loss (S22), and  
Gain (S21) vs. Frequency  
Table 5. Recommended Components for Basic Connections  
Frequency  
C1  
C2  
C3  
L1  
C4  
C5  
C6  
C7  
50 MHz to 500 MHz  
500 MHz to 6000 MHz  
0.1 μF 0.1 μF 1 μF 470 nH (Coilcraft 0603LS-471-NX or equivalent)  
68 pF 1.2 nF 1 μF 68 pF  
68 pF 1.2 nF 1 μF 68 pF  
33 pF  
33 pF  
1 μF 47 nH (Coilcraft 0603CS-47-NX or equivalent)  
Rev. 0 | Page 10 of 12  
 
 
 
 
 
 

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